公开(公告)号：US20210002528A1

公开(公告)日：2021-01-07

申请号：US17040761

申请日：2019-03-11

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Tasuku YAMADA ,  Shiori TATENO ,  Yousuke CHIBA ,  Takayuki MAEDA ,  Yukio OCHITANI ,  Hideaki TANAKA

IPC: C09J163/00 ,  C09J11/04

Abstract: The present invention provides an epoxy adhesive composition capable of reducing re-aggregation of an adhesive layer modifier, maintaining favorable viscosity for a long period of time, exhibiting high adhesiveness, and reducing process failures during application of the adhesive. Provided is an epoxy adhesive composition containing: a modified polyvinyl acetal resin having a constitutional unit with an acid-modified group; an adhesive layer modifier; and an epoxy resin, the epoxy adhesive composition having a ratio of an acid-modified group equivalent of the modified polyvinyl acetal resin to an epoxy equivalent of the epoxy resin (acid-modified group equivalent/epoxy equivalent) of 5.0 to 150.0, the epoxy adhesive composition having a number ratio of the acid-modified group to an epoxy group (acid-modified group number/epoxy group number) of 0.0005 to 0.5.