Invention Application
- Patent Title: INSULATION SHEET, LAMINATE, AND SUBSTRATE
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Application No.: US16977569Application Date: 2019-04-17
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Publication No.: US20210008839A1Publication Date: 2021-01-14
- Inventor: Rui ZHANG , Keigo OOWASHI , Kouji ASHIBA , Aki KOUMA , Shohei MIZUNO
- Applicant: SEKISUI CHEMICAL CO., LTD.
- Applicant Address: JP Osaka
- Assignee: SEKISUI CHEMICAL CO., LTD.
- Current Assignee: SEKISUI CHEMICAL CO., LTD.
- Current Assignee Address: JP Osaka
- Priority: JP2018-079028 20180417
- International Application: PCT/JP2019/016454 WO 20190417
- Main IPC: B32B15/092
- IPC: B32B15/092 ; B32B27/08 ; B32B27/20 ; B32B27/38 ; C08K3/38 ; H05K1/03

Abstract:
An electrical insulation sheet comprising a resin composition layer, wherein one surface side has a higher relative permittivity at a frequency of 1 MHz than the relative permittivity of an other surface side, and a circuit pattern is formed on the one surface side, a laminated body comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein a circuit pattern is formed on the metal plate, and a substrate comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein the metal plate has a circuit pattern.
Public/Granted literature
- US11548264B2 Insulation sheet, laminate, and substrate Public/Granted day:2023-01-10
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