公开(公告)号：US20230056185A1

公开(公告)日：2023-02-23

申请号：US17793544

申请日：2021-01-19

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Shohei MIZUNO ,  Aki KOUMA ,  Takashi SHINJOU ,  Kaoru SHIBUTA

IPC: C09K5/14 ,  C08J5/18 ,  C08K3/38 ,  C08K3/22 ,  B32B15/04

Abstract: A thermally conductive sheet has a thermally conductive resin composition layer, wherein the thermally conductive resin composition layer is made of a thermally conductive resin composition (1) including an inorganic filler and a binder resin (3). The inorganic filler includes a boron nitride particle (2), the content of the inorganic filler in the thermally conductive resin composition layer is 65% by volume or more, and the boron nitride particle (2) has an average aspect ratio of 7 or less, which is calculated from a major axis and a minor axis of a primary particle measured by a specific method. The thermally conductive resin composition layer has a thickness of 200 μm or less.

公开(公告)号：US20210008839A1

公开(公告)日：2021-01-14

申请号：US16977569

申请日：2019-04-17

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Rui ZHANG ,  Keigo OOWASHI ,  Kouji ASHIBA ,  Aki KOUMA ,  Shohei MIZUNO

IPC: B32B15/092 ,  B32B27/08 ,  B32B27/20 ,  B32B27/38 ,  C08K3/38 ,  H05K1/03

Abstract: An electrical insulation sheet comprising a resin composition layer, wherein one surface side has a higher relative permittivity at a frequency of 1 MHz than the relative permittivity of an other surface side, and a circuit pattern is formed on the one surface side, a laminated body comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein a circuit pattern is formed on the metal plate, and a substrate comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein the metal plate has a circuit pattern.