公开(公告)号：US20200216659A1

公开(公告)日：2020-07-09

申请号：US16623108

申请日：2018-06-21

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Yuko KAWAHARA ,  Keigo OOWASHI ,  Kouji ASHIBA ,  Rui ZHANG ,  Osamu INUI ,  Hiroshi MAENAKA

IPC: C08L63/00 ,  B32B27/18

Abstract: Provided is a resin material capable of effectively enhancing adhesiveness and long-term insulation reliability. The resin material according to the present invention contains first inorganic particles having an average aspect ratio of 2 or less, second inorganic particles having an average aspect ratio of more than 2, and a binder resin, an absolute value of a difference between an average particle diameter of the first inorganic particles and an average major diameter of the second inorganic particles is 10 μm or less, the average particle diameter of the first inorganic particles is 1 μm or more and less than 20 μm, the average major diameter of the second inorganic particles is 2 μm or more, and the content of the second inorganic particles is more than 40% by volume relative to 100% by volume of sum of the first inorganic particles and the second inorganic particles.

公开(公告)号：US20210008839A1

公开(公告)日：2021-01-14

申请号：US16977569

申请日：2019-04-17

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Rui ZHANG ,  Keigo OOWASHI ,  Kouji ASHIBA ,  Aki KOUMA ,  Shohei MIZUNO

IPC: B32B15/092 ,  B32B27/08 ,  B32B27/20 ,  B32B27/38 ,  C08K3/38 ,  H05K1/03

Abstract: An electrical insulation sheet comprising a resin composition layer, wherein one surface side has a higher relative permittivity at a frequency of 1 MHz than the relative permittivity of an other surface side, and a circuit pattern is formed on the one surface side, a laminated body comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein a circuit pattern is formed on the metal plate, and a substrate comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein the metal plate has a circuit pattern.