- 专利标题: ELECTRONIC DEVICE INCLUDING A SHIELDING SHEET AND A HEAT RADIATION MEMBER
-
申请号: US16899118申请日: 2020-06-11
-
公开(公告)号: US20210029855A1公开(公告)日: 2021-01-28
- 发明人: Hyunjoong YOON , Myunghoon KWAK , Minki PARK , Youngjae YOU , Yongsang YUN
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2019-0090425 20190725
- 主分类号: H05K9/00
- IPC分类号: H05K9/00 ; H05K7/20 ; H01L23/40 ; H01L23/552
摘要:
An electronic device having a shielding structure disposed around electronic components and having high heat dissipation performance is provided. The electronic device includes a circuit board, at least one electronic component mounted on a surface of the circuit board, a shielding sheet attached to the surface of the circuit board to cover the at least one electronic component, a thermal interface material stacked on the shielding sheet to overlap the at least one electronic component, and a heat dissipation member disposed to face the surface of the circuit board, being in surface contact with the thermal interface material, and fastened to at least a portion of the circuit board by a fixing member. Various other embodiments may be possible.