公开(公告)号：US20220272868A1

公开(公告)日：2022-08-25

申请号：US17673099

申请日：2022-02-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hongki MOON ,  Kyungha KOO ,  Yoonsun PARK ,  Youngjae YOU ,  Hyunjoo LEE ,  Joseph AHN

IPC: H05K7/20

Abstract: An electronic device may include: a housing, a support member disposed in an internal space of the housing and including a first surface and a second surface facing a direction opposite the first surface, wherein the support member includes a through hole in at least a portion thereof, and a vapor chamber disposed through at least a portion of the through-hole, wherein the vapor chamber may include: a first plate including a first plate portion including a plurality of pillars and a first flange portion extending along an edge of the first plate portion to have a first width, a second plate having a size corresponding to the first plate portion and including a second plate portion including a recess and a second flange portion extending along an edge of the second plate portion to have a second width less than the first width, and at least one wick disposed in the recess, wherein the wick may be accommodated through a closed space defined through coupling of the first plate and the second plate.

公开(公告)号：US20220417795A1

公开(公告)日：2022-12-29

申请号：US17901730

申请日：2022-09-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seungjoo LEE ,  Seungchul CHOI ,  Youngsan KIM ,  Youngjae YOU

IPC: H04W28/20 ,  H04W8/24

Abstract: An electronic device of the disclosure may comprise: a communication circuit and at least one processor, wherein the at least one processor is configured to: control the communication circuit to transmit first capability information of the electronic device to a base station, identify, based on data throughput, whether an additional resource is needed, and based on identifying that the additional resource is needed, control the communication circuit to transmit an additional resource request message to the base station, wherein the first capability information comprises a request related to a basic resource, and the basic resource comprises at least one of a number of component carriers (CCs), a number of multiple-input multiple-output (MIMO) layers, or a bandwidth in an operating band.

公开(公告)号：US20210029855A1

公开(公告)日：2021-01-28

申请号：US16899118

申请日：2020-06-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunjoong YOON ,  Myunghoon KWAK ,  Minki PARK ,  Youngjae YOU ,  Yongsang YUN

IPC: H05K9/00 ,  H05K7/20 ,  H01L23/40 ,  H01L23/552

Abstract: An electronic device having a shielding structure disposed around electronic components and having high heat dissipation performance is provided. The electronic device includes a circuit board, at least one electronic component mounted on a surface of the circuit board, a shielding sheet attached to the surface of the circuit board to cover the at least one electronic component, a thermal interface material stacked on the shielding sheet to overlap the at least one electronic component, and a heat dissipation member disposed to face the surface of the circuit board, being in surface contact with the thermal interface material, and fastened to at least a portion of the circuit board by a fixing member. Various other embodiments may be possible.