Invention Application
- Patent Title: FinFET Device and Method of Forming and Monitoring Quality of the Same
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Application No.: US17074532Application Date: 2020-10-19
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Publication No.: US20210036148A1Publication Date: 2021-02-04
- Inventor: Chang-Yin Chen , Che-Cheng Chang , Chih-Han Lin , Horng-Huei Tseng
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L29/51 ; H01L29/49 ; H01L29/423 ; H01L21/3213 ; H01L21/66 ; H01L21/8234 ; H01L21/67

Abstract:
A FinFET structure with a gate structure having two notch features therein and a method of forming the same is disclosed. The FinFET notch features ensure that sufficient spacing is provided between the gate structure and source/drain regions of the FinFET to avoid inadvertent shorting of the gate structure to the source/drain regions. Gate structures of different sizes (e.g., different gate widths) and of different pattern densities can be provided on a same substrate and avoid inadvertent of shorting the gate to the source/drain regions through application of the notched features.
Public/Granted literature
- US11522084B2 FinFET device and method of forming and monitoring quality of the same Public/Granted day:2022-12-06
Information query
IPC分类: