Invention Application
- Patent Title: LATERAL DOUBLE-DIFFUSED METAL OXIDE SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREFOR
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Application No.: US16645139Application Date: 2018-09-01
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Publication No.: US20210036150A1Publication Date: 2021-02-04
- Inventor: Nailong HE , Sen ZHANG , Xuchao LI
- Applicant: CSMC TECHNOLOGIES FAB2 CO., LTD.
- Applicant Address: CN Jiangsu
- Assignee: CSMC TECHNOLOGIES FAB2 CO., LTD.
- Current Assignee: CSMC TECHNOLOGIES FAB2 CO., LTD.
- Current Assignee Address: CN Jiangsu
- Priority: CN201710801871.7 20170907
- International Application: PCT/CN2018/900005 WO 20180901
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L21/762 ; H01L29/06

Abstract:
A lateral double-diffused metal oxide semiconductor component and a manufacturing method therefor. The lateral double-diffused metal oxide semiconductor component comprises: a semiconductor substrate, the semiconductor substrate being provided thereon with a drift area; the drift area being provided therein with a trap area and a drain area, the trap area being provided therein with an active area and a channel; the drift area being provided therein with a deep trench isolation structure arranged between the trap area and the drain area, and the deep trench isolation structure being provided at the bottom thereof with alternately arranged first p-type injection areas and first n-type injection areas.
Public/Granted literature
- US11227948B2 Lateral double-diffused metal oxide semiconductor component and manufacturing method therefor Public/Granted day:2022-01-18
Information query
IPC分类: