Invention Application
- Patent Title: TEMPERATURE COMPENSATION CIRCUIT AND TEMPERATURE COMPENSATED AMPLIFIER CIRCUIT
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Application No.: US16528536Application Date: 2019-07-31
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Publication No.: US20210036663A1Publication Date: 2021-02-04
- Inventor: Joseph Staudinger , Yu You , Donald Vernon Hayes
- Applicant: NXP USA, Inc.
- Applicant Address: US TX Austin
- Assignee: NXP USA, Inc.
- Current Assignee: NXP USA, Inc.
- Current Assignee Address: US TX Austin
- Main IPC: H03F1/30
- IPC: H03F1/30 ; H03F3/04

Abstract:
Embodiments of a temperature compensation circuit and a temperature compensated amplifier circuit are disclosed. In an embodiment, a temperature compensation circuit includes a bias reference circuit having serially connected transistor devices and a driver transistor device connected to the bias reference circuit. At least one of the serially connected transistor devices includes a resistor connected between two terminals of the at least one of the serially connected transistor devices. The driver transistor device is configured to generate a drive current based on a resistance value of the resistor.
Public/Granted literature
- US11196391B2 Temperature compensation circuit and temperature compensated amplifier circuit Public/Granted day:2021-12-07
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