-
公开(公告)号：US20210036663A1
公开(公告)日：2021-02-04
申请号：US16528536
申请日：2019-07-31
Applicant: NXP USA, Inc.
Inventor： Joseph Staudinger , Yu You , Donald Vernon Hayes
Abstract: Embodiments of a temperature compensation circuit and a temperature compensated amplifier circuit are disclosed. In an embodiment, a temperature compensation circuit includes a bias reference circuit having serially connected transistor devices and a driver transistor device connected to the bias reference circuit. At least one of the serially connected transistor devices includes a resistor connected between two terminals of the at least one of the serially connected transistor devices. The driver transistor device is configured to generate a drive current based on a resistance value of the resistor.
-
公开(公告)号：US11196391B2
公开(公告)日：2021-12-07
申请号：US16528536
申请日：2019-07-31
Applicant: NXP USA, Inc.
Inventor： Joseph Staudinger , Yu You , Donald Vernon Hayes
Abstract: Embodiments of a temperature compensation circuit and a temperature compensated amplifier circuit are disclosed. In an embodiment, a temperature compensation circuit includes a bias reference circuit having serially connected transistor devices and a driver transistor device connected to the bias reference circuit. At least one of the serially connected transistor devices includes a resistor connected between two terminals of the at least one of the serially connected transistor devices. The driver transistor device is configured to generate a drive current based on a resistance value of the resistor.
-
Search Results
2
records
(took 0.011 seconds)
