TEMPERATURE COMPENSATION CIRCUIT AND TEMPERATURE COMPENSATED AMPLIFIER CIRCUIT

    公开(公告)号:US20210036663A1

    公开(公告)日:2021-02-04

    申请号:US16528536

    申请日:2019-07-31

    Applicant: NXP USA, Inc.

    Abstract: Embodiments of a temperature compensation circuit and a temperature compensated amplifier circuit are disclosed. In an embodiment, a temperature compensation circuit includes a bias reference circuit having serially connected transistor devices and a driver transistor device connected to the bias reference circuit. At least one of the serially connected transistor devices includes a resistor connected between two terminals of the at least one of the serially connected transistor devices. The driver transistor device is configured to generate a drive current based on a resistance value of the resistor.

    RF power amplifier bias modulation with programmable stages

    公开(公告)号:US10148228B2

    公开(公告)日:2018-12-04

    申请号:US15384601

    申请日:2016-12-20

    Applicant: NXP USA, Inc.

    Abstract: A Doherty amplifier is able to enhance efficiency in low-power and high-power RF communication states by enabling carrier and peaking amplifiers as required, and controlling bias modulation, depending on traffic loading levels in each of a set of consecutive communications timeslots. For example, if, in a low-power state, traffic loading levels do not exceed a relatively lower threshold in a communications timeslot, carrier amplifiers are selectively enabled as needed, peaking amplifiers are not enabled, and carrier amplifier bias levels are kept substantially constant. If, in an intermediate-power state, the lower threshold is exceeded but a relatively higher threshold is not exceeded, all carrier amplifiers are enabled, peaking amplifiers are selectively enabled, and bias levels are kept substantially constant. If, in a high-power state, the higher threshold is exceeded, all carrier and peaking amplifiers can be enabled, and the peaking amplifier bias tracks the RF envelope of the received RF signal.

    Temperature compensation circuit and temperature compensated amplifier circuit

    公开(公告)号:US11196391B2

    公开(公告)日:2021-12-07

    申请号:US16528536

    申请日:2019-07-31

    Applicant: NXP USA, Inc.

    Abstract: Embodiments of a temperature compensation circuit and a temperature compensated amplifier circuit are disclosed. In an embodiment, a temperature compensation circuit includes a bias reference circuit having serially connected transistor devices and a driver transistor device connected to the bias reference circuit. At least one of the serially connected transistor devices includes a resistor connected between two terminals of the at least one of the serially connected transistor devices. The driver transistor device is configured to generate a drive current based on a resistance value of the resistor.

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