- 专利标题: Transistors with Channels Formed of Low-Dimensional Materials and Method Forming Same
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申请号: US16837261申请日: 2020-04-01
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公开(公告)号: US20210066627A1公开(公告)日: 2021-03-04
- 发明人: Chao-Ching Cheng , Tzu-Ang Chao , Chun-Chieh Lu , Hung-Li Chiang , Tzu-Chiang Chen , Lain-Jong Li
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsinchu
- 主分类号: H01L51/05
- IPC分类号: H01L51/05 ; H01L51/00 ; H01L21/02 ; H01L29/66 ; H01L29/06 ; H01L29/24 ; H01L29/423 ; H01L29/786
摘要:
A method includes forming a first low-dimensional layer over an isolation layer, forming a first insulator over the first low-dimensional layer, forming a second low-dimensional layer over the first insulator, forming a second insulator over the second low-dimensional layer, and patterning the first low-dimensional layer, the first insulator, the second low-dimensional layer, and the second insulator into a protruding fin. Remaining portions of the first low-dimensional layer, the first insulator, the second low-dimensional layer, and the second insulator form a first low-dimensional strip, a first insulator strip, a second low-dimensional strip, and a second insulator strip, respectively. A transistor is then formed based on the protruding fin.
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