Invention Application
- Patent Title: SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD
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Application No.: US17017786Application Date: 2020-09-11
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Publication No.: US20210072644A1Publication Date: 2021-03-11
- Inventor: Hae-Won CHOI , Yerim YEON , Anton KORIAKIN , Kihoon CHOI , Youngran KO , Jeong Ho CHO , Hyungseok KANG , Hong Gi MIN
- Applicant: SEMES CO., LTD. , RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
- Applicant Address: KR Cheonan-si; KR Gyeonggi-do
- Assignee: SEMES CO., LTD.,RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
- Current Assignee: SEMES CO., LTD.,RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
- Current Assignee Address: KR Cheonan-si; KR Gyeonggi-do
- Priority: KR10-2019-0112630 20190911
- Main IPC: G03F7/16
- IPC: G03F7/16 ; H01L21/67
Abstract:
A substrate treating apparatus and a substrate treating method are provided. The substrate treating apparatus includes a first process chamber to apply an organic solvent to a substrate applied with a developer and introduced, and a second process chamber to treat the substrate applied with the organic solvent and introduced, through a supercritical fluid.
Public/Granted literature
- US11977332B2 Substrate treating apparatus and substrate treating method Public/Granted day:2024-05-07
Information query
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