Invention Application
- Patent Title: Form Board Preparation for Wire Bundling
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Application No.: US16666270Application Date: 2019-10-28
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Publication No.: US20210125750A1Publication Date: 2021-04-29
- Inventor: Lars E. Blacken , Damien O. Martin , Eerik J. Helmick , Keith M. Cutler , John R. Porter
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Main IPC: H01B13/012
- IPC: H01B13/012 ; H01R43/20 ; G06F17/50

Abstract:
Systems and methods for designing and assembling form boards with attached wire routing devices for use in wire bundle assembly. The assembly method comprises: (a) establishing a coordinate system of a form board having a multiplicity of holes; (b) using a computer system to determine locations of form board devices of different types with reference to the coordinate system of the form board based on engineering data specifying a wire bundle configuration; and (c) fastening the form board devices of different types to respective holes of the form board having centers closest to respective locations determined in step (b). The form board devices may be inserted robotically or manually.
Public/Granted literature
- US11328842B2 Form board preparation for wire bundling Public/Granted day:2022-05-10
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