- 专利标题: CONTROL METHOD AND PLASMA PROCESSING APPARATUS
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申请号: US17076463申请日: 2020-10-21
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公开(公告)号: US20210125814A1公开(公告)日: 2021-04-29
- 发明人: Mikio SATO , Eiki KAMATA , Taro IKEDA
- 申请人: Tokyo Electron Limited
- 申请人地址: JP Tokyo
- 专利权人: Tokyo Electron Limited
- 当前专利权人: Tokyo Electron Limited
- 当前专利权人地址: JP Tokyo
- 优先权: JP2019-195656 20191028
- 主分类号: H01J37/32
- IPC分类号: H01J37/32 ; H01L21/67 ; H01L21/66 ; C23C16/50 ; C23C16/52
摘要:
A method of controlling a scanning-type plasma processing apparatus using a phased array antenna, includes observing light emission of plasma generated inside a processing container through observation windows provided at multiple positions in the processing container, calculating an in-plane distribution of values representing characteristics of the plasma on a substrate, based on data on the observed light emission of the plasma, and correcting a scanning pattern and/or a plasma density distribution of the plasma based on the calculated in-plane distribution of the values representing the characteristics of the plasma on the substrate.
公开/授权文献
- US11887825B2 Control method and plasma processing apparatus 公开/授权日:2024-01-30
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