- 专利标题: LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
-
申请号: US17132987申请日: 2020-12-23
-
公开(公告)号: US20210187667A1公开(公告)日: 2021-06-24
- 发明人: Yuki Saeki
- 申请人: Via Mechanics, Ltd.
- 申请人地址: JP Kanagawa
- 专利权人: Via Mechanics, Ltd.
- 当前专利权人: Via Mechanics, Ltd.
- 当前专利权人地址: JP Kanagawa
- 优先权: JP2019-232313 20191224
- 主分类号: B23K26/382
- IPC分类号: B23K26/382 ; B23K26/00 ; B23K26/04 ; B23K26/046 ; B23K26/0622 ; B23K26/064 ; B23K26/082
摘要:
A purpose of the present invention is to quickly change a focal point of a laser emission system so that processing with high quality and good processing efficiency can be performed. In a laser processing apparatus including: a laser oscillator configured to output a laser pulse; a laser polarizer configured to polarize the laser pulse in a two-dimensional direction; and a controller configured to control the laser oscillator and the laser polarizer, the laser processing apparatus being configured to emit the laser pulse to a workpiece for processing the workpiece, the laser processing apparatus has a feature in which an electrooptic device capable of, under control of the controller, electrically changing a focal point of the laser pulse to be input to the laser polarizer is arranged in an input side of the laser polarizer.
公开/授权文献
- US11980971B2 Laser processing apparatus and laser processing method 公开/授权日:2024-05-14
信息查询
IPC分类: