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    Laser processing device, laser processing system and laser processing method
    1.
    发明授权
    Laser processing device, laser processing system and laser processing method 有权

    公开(公告)号：US12191168B2

    公开(公告)日：2025-01-07

    申请号：US16979191

    申请日：2019-03-27

    Applicant: Tokyo Electron Limited

    Inventor： Hirotoshi Mori ,  Yoshihiro Kawaguchi ,  Hayato Tanoue ,  Kazuya Hisano

    IPC: H01L21/67 ,  B23K26/00 ,  B23K26/03 ,  B23K26/046 ,  B23K26/06 ,  B23K26/082 ,  B23K26/53 ,  G01B11/06 ,  H01L21/268 ,  H01L21/78 ,  H01L23/544

    Abstract: A laser processing device includes a height measurement unit configured to measure a vertical direction position of an irradiation point of a processing laser beam on an upper surface of a substrate; and a controller configured to control a vertical direction position of a light condensing unit based on the vertical direction position of the irradiation point while moving the irradiation point along multiple dividing target lines. The height measurement unit includes a coaxial laser displacement meter and a separate-axis laser displacement meter. The controller controls the vertical direction position of the light condensing unit by using only one of the coaxial or the separate-axis laser displacement meter for each of the multiple dividing target lines while the substrate is processed and performs a switchover of a laser displacement meter for controlling the vertical direction position of the light condensing unit between the coaxial and the separate-axis laser displacement meters.

    Lightguide device and laser processing device
    2.
    发明授权
    Lightguide device and laser processing device 有权

    公开(公告)号：US12186829B2

    公开(公告)日：2025-01-07

    申请号：US17250247

    申请日：2019-06-19

    Applicant: KAWASAKI JUKOGYO KABUSHIKI KAISHA

    Inventor： Mutsuhiro Nakazawa ,  Osami Oogushi

    IPC: B23K26/06 ,  B23K26/046 ,  B23K26/082 ,  B23K103/16 ,  G02B26/12

    Abstract: A light guide device includes a first light guide part, a polygon mirror, a second light guide part, and an adjustment part. The first part reflects and guides a laser light emitted from a laser generator. The polygon mirror has a reflective part which reflects the light guided by the first part while the reflective part rotates. The second part reflects the light reflected at the reflective part and directs the light so that the light is illuminated to the workpiece at each reflective part, respectively. The adjustment part adjusts the position of the light incident on the polygon mirror in the rotation axis direction of the optical axis, thereby changing the positions of light incident on the irradiation target in the line width direction. The irradiation target is irradiated with the light while the position of the light in a line width direction.

    Laser processing apparatus and laser processing method
    4.
    发明授权
    Laser processing apparatus and laser processing method 有权

    公开(公告)号：US11980971B2

    公开(公告)日：2024-05-14

    申请号：US17132987

    申请日：2020-12-23

    Applicant: Via Mechanics, Ltd.

    Inventor： Yuki Saeki

    IPC: B23K26/382 ,  B23K26/00 ,  B23K26/04 ,  B23K26/046 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/082

    CPC classification number: B23K26/382 ,  B23K26/0006 ,  B23K26/043 ,  B23K26/046 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/082

    Abstract: A purpose of the present invention is to quickly change a focal point of a laser emission system so that processing with high quality and good processing efficiency can be performed. In a laser processing apparatus including: a laser oscillator configured to output a laser pulse; a laser deflector configured to deflect the laser pulse in a two-dimensional direction; and a controller configured to control the laser oscillator and the laser deflector, the laser processing apparatus being configured to emit the laser pulse to a workpiece for processing the workpiece, the laser processing apparatus has a feature in which an electrooptic device capable of, under control of the controller, electrically changing a focal point of the laser pulse to be input to the laser deflector is arranged in an input side of the laser deflector.

    A LASER ETCHING METHOD FOR MEMS PROBES
    7.
    发明公开
    A LASER ETCHING METHOD FOR MEMS PROBES 审中-公开

    公开(公告)号：US20240001485A1

    公开(公告)日：2024-01-04

    申请号：US18039570

    申请日：2021-07-27

    Applicant: MAXONE SEMICONDUCTOR CO., LTD.

    Inventor： Haichao YU ,  Ming ZHOU

    IPC: B23K26/046 ,  B23K26/06 ,  B23K26/362 ,  B23K26/08

    CPC classification number: B23K26/046 ,  B23K26/0648 ,  B23K26/362 ,  B23K26/0861 ,  G01R1/06744

    Abstract: A laser etching method for MEMS probes belongs to the technical field of semiconductor processing and testing; first, the MEMS probe laser etching method performs the parameter calculation to obtain the step angle of the motor according to the etching spacing of the single crystal silicon wafer; then it performs the initial position adjustment to rotate the spiral through-groove plate to the initial position and move the first etching point to the optical axis, and adjust the four-dimensional stage; and then it performs the laser etching and progress judgment; and finally adjusts the four-dimensional stage and the motor, including the downward movement distance, left movement distance and clockwise rotation angle of the four-dimensional stage and the rotation angle of the motor; the MEMS probe laser etching method, combined with the MEMS probe laser etching device, not only has higher etching accuracy, but also continuously adjusts the etching spacing.

    Laser conformal manufacturing method of flexible sensor
    8.
    发明授权
    Laser conformal manufacturing method of flexible sensor 有权

    公开(公告)号：US11833760B2

    公开(公告)日：2023-12-05

    申请号：US18109529

    申请日：2023-02-14

    Applicant: Xiamen University

    Inventor： Wei Zhou ,  Rui Chen ,  Xinning Zhu ,  Tao Luo ,  Weisong Ling ,  Chiqian Xiao

    IPC: B29C64/386 ,  B23K26/046 ,  B33Y50/02 ,  B23K26/359 ,  B23K37/04

    CPC classification number: B29C64/386 ,  B23K26/046 ,  B23K26/359 ,  B23K37/0417 ,  B33Y50/02

    Abstract: A laser conformal manufacturing method of a flexible sensor comprises: obtaining morphology data of a curved surface, and constructing a Standard Triangle Language (STL) model of the curved surface; introducing into a 3D modeling software, and combining the curved surface with a clamper holder; manufacturing to obtain the clamper with the curved surface; coating material to be manufactured on a 3D curved surface of the clamper with the curved surface; positioning to a processing platform of a laser device; constructing a model of a pattern to be manufactured by laser based on the STL model of the curved surface, and constructing an STL model or a dwg model of the pattern to be manufactured; introducing into the laser device, turning on the laser device, and running a 3D dynamic focus system; repeating the steps 4-8, and stripping the flexible sensor from the 3D curved surface.

    Laser processing machine
    9.
    发明授权
    Laser processing machine 有权

    公开(公告)号：US11801570B2

    公开(公告)日：2023-10-31

    申请号：US17100022

    申请日：2020-11-20

    Applicant: MITUTOYO CORPORATION

    Inventor： Koji Kubo

    IPC: B23K26/06 ,  B23K26/0622 ,  B23K26/066 ,  B23K26/03 ,  B23K26/046

    CPC classification number: B23K26/0648 ,  B23K26/032 ,  B23K26/046 ,  B23K26/066 ,  B23K26/0622

    Abstract: A laser processing machine includes: a variable focal length optical system in which a focus position is periodically changed in response to a drive signal to be inputted; a position-detection light source configured to emit a detection light onto a workpiece through the variable focal length optical system; a light detector configured to receive the detection light reflected on the workpiece and output a light detection signal; a signal processor configured to output a synchronization pulse signal in synchronization with the focus timing when the detection light is focused on the surface of the workpiece in accordance with the inputted light detection signal; and a laser oscillator configured to oscillate a pulse laser beam in accordance with the inputted synchronization pulse signal to radiate the pulse laser beam on the workpiece through the variable focal length optical system.

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