- 专利标题: MICROMECHANICAL SENSOR
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申请号: US17059729申请日: 2019-06-06
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公开(公告)号: US20210214213A1公开(公告)日: 2021-07-15
- 发明人: Jan Waldmann , Rolf Scheben , Rudy Eid
- 申请人: Robert Bosch GmbH
- 申请人地址: DE Stuttgart
- 专利权人: Robert Bosch GmbH
- 当前专利权人: Robert Bosch GmbH
- 当前专利权人地址: DE Stuttgart
- 优先权: DE102018210111.6 20180621
- 国际申请: PCT/EP2019/064772 WO 20190606
- 主分类号: B81B3/00
- IPC分类号: B81B3/00 ; G01P1/00 ; G01P1/02 ; G01P15/125 ; G01P3/44
摘要:
A micromechanical sensor. The sensor includes a substrate, a cap element situated on the substrate, at least one seismic mass that is deflectable orthogonal to the cap element, an internal pressure that is lower by a defined amount relative to the surrounding environment prevailing inside a cavity, and a compensating element designed to provide a homogenization of a temperature gradient field in the cavity during operation of the micromechanical sensor.
公开/授权文献
- US11485630B2 Micromechanical sensor 公开/授权日:2022-11-01
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