MICROMECHANICAL SENSOR
    4.
    发明申请

    公开(公告)号:US20210214213A1

    公开(公告)日:2021-07-15

    申请号:US17059729

    申请日:2019-06-06

    Abstract: A micromechanical sensor. The sensor includes a substrate, a cap element situated on the substrate, at least one seismic mass that is deflectable orthogonal to the cap element, an internal pressure that is lower by a defined amount relative to the surrounding environment prevailing inside a cavity, and a compensating element designed to provide a homogenization of a temperature gradient field in the cavity during operation of the micromechanical sensor.

    Micromechanical sensor
    5.
    发明授权

    公开(公告)号:US11485630B2

    公开(公告)日:2022-11-01

    申请号:US17059729

    申请日:2019-06-06

    Abstract: A micromechanical sensor. The sensor includes a substrate, a cap element situated on the substrate, at least one seismic mass that is deflectable orthogonal to the cap element, an internal pressure that is lower by a defined amount relative to the surrounding environment prevailing inside a cavity, and a compensating element designed to provide a homogenization of a temperature gradient field in the cavity during operation of the micromechanical sensor.

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