- 专利标题： COMPOUND FOR RELEASE AGENT AND METHOD FOR PREPARING THE SAME
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申请号： US16972783申请日： 2020-08-26
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公开(公告)号： US20210261795A1公开(公告)日： 2021-08-26
- 发明人: Hyun Joong KIM , Hong Chul KIM , Sung-Do LEE
- 申请人： CEKO CO., LTD.
- 申请人地址： KR Gyeonggi-do
- 专利权人： CEKO CO., LTD.
- 当前专利权人： CEKO CO., LTD.
- 当前专利权人地址： KR Gyeonggi-do
- 优先权： KR10-2019-0114634 20190918
- 国际申请： PCT/KR2020/011357 WO 20200826
- 主分类号： C09D5/20
- IPC分类号： C09D5/20 ; C07C271/14 ; C07C271/28 ; C07C69/63 ; C07C43/174 ; C23C14/24 ; C23C14/12
摘要：
The present invention relates to a compound for release agent and method for preparing the same, and more specifically, to a compound for a release agent that can be coated in an ultra-thin form without thermal deformation even when heat is continuously or discontinuously applied in a continuous evaporator, and a method for preparing the same.
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