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公开(公告)号:US20170088935A1
公开(公告)日:2017-03-30
申请号:US14112588
申请日:2013-07-23
申请人: CEKO Co., Ltd.
发明人: Hyun Joong KIM , Hong Chul KIM , Kyung Il JUN , Joung Rae KIM , Young Jun HWANG
CPC分类号: C23C14/243 , C23C14/26 , H05B3/03 , H05B3/12 , H05B2203/021 , H05B2203/022
摘要: The present invention is a vacuum evaporation heating assembly for heating a carrier, in which an evaporation material is filled, in a vacuum evaporation process, the vacuum evaporation heating assembly comprising: a carrier container in which the carrier is installed; and an electrode connector which extends in both directions of the carrier container to be connected to an electrode. At least one of the carrier container and the electrode connector is a plate-shaped member. The vacuum evaporation heating assembly can securely hold the carrier, in which the evaporation material is filled, and can vaporize the evaporation material in a specialized direction, thereby uniformly and efficiently evaporating the evaporation material with a small number of carriers.
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2.
公开(公告)号:US20200147567A1
公开(公告)日:2020-05-14
申请号:US16490778
申请日:2017-03-03
发明人: Jong Wook HONG , Soo Jeong SHIN , Hyun Joong KIM , Hong Chul KIM , Jeong Rae KIM , Byeong Gyeong CHOI , Cheol Min KIM
摘要: The present invention relates to a method for modifying the surface of a polymer substrate. Specifically, the present invention provides a method for modifying the surface of a polymer substrate using a plasma treatment, a hydrophilic primer and a coating agent including a hydrophobic fluorine compound.
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公开(公告)号:US20210261795A1
公开(公告)日:2021-08-26
申请号:US16972783
申请日:2020-08-26
申请人: CEKO CO., LTD.
发明人: Hyun Joong KIM , Hong Chul KIM , Sung-Do LEE
IPC分类号: C09D5/20 , C07C271/14 , C07C271/28 , C07C69/63 , C07C43/174 , C23C14/24 , C23C14/12
摘要: The present invention relates to a compound for release agent and method for preparing the same, and more specifically, to a compound for a release agent that can be coated in an ultra-thin form without thermal deformation even when heat is continuously or discontinuously applied in a continuous evaporator, and a method for preparing the same.
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公开(公告)号:US20210115174A1
公开(公告)日:2021-04-22
申请号:US16605065
申请日:2018-04-12
申请人: CEKO CO., LTD. , DANKOOK UNIVERSITY CHEONAN CAMPUS INDUSTRY ACADEMIC , POSTECH ACADEMY-INDUSTRY FOUNDATION
发明人: Moon Hor REE , Kyung Ho KWON , Won Yeong RYU , Kwan Young HAN , Sung Kyoo LIM , Byung Min PARK , Dong Hoon JANG , Hyun Joong KIM , Hong Chul KIM , Jeong Rae KIM
IPC分类号: C08F220/20 , C08F220/34 , C08F220/56 , C08F220/30 , C09D133/08 , C09D133/06 , C09D133/14 , C08F220/28
摘要: The present invention relates to a polyvinyl-based compound, which maximizes self-healing ability by introducing various functional molecules into a brush of a polyvinyl-based resin, a preparation method thereof, and a polymer coating film produced therefrom.
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