Invention Application
- Patent Title: ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
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Application No.: US17206656Application Date: 2021-03-19
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Publication No.: US20210305231A1Publication Date: 2021-09-30
- Inventor: Yusuke OBA , Kenichi YOSHIDA , Takashi OHTSUKA , Yuichiro OKUYAMA , Tomoya HANAI , Yu FUKAE
- Applicant: TDK CORPORATION
- Applicant Address: JP TOKYO
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP TOKYO
- Priority: JP2020-054874 20200325
- Main IPC: H01L27/01
- IPC: H01L27/01 ; H01L21/78 ; H01L21/70

Abstract:
Disclosed herein is an electronic component that includes a substrate, a functional layer formed on the substrate and having a plurality of alternately stacked conductor layers and insulating layers, and a plurality of terminal electrodes provided on an uppermost one of the insulating layers. The uppermost one of the insulating layers has a substantially rectangular planar shape and has a protruding part protruding in a planar direction from at least one side in a plan view.
Public/Granted literature
- US11776947B2 Electronic component and manufacturing method therefor Public/Granted day:2023-10-03
Information query
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