公开(公告)号：US20210225593A1

公开(公告)日：2021-07-22

申请号：US17143581

申请日：2021-01-07

Applicant: TDK CORPORATION

Inventor： Kazuhiro YOSHIKAWA ,  Kenichi YOSHIDA ,  Takashi OHTSUKA ,  Yuichiro OKUYAMA ,  Takeshi OOHASHI ,  Hajime KUWAJIMA

IPC: H01G4/30 ,  H01G4/08 ,  H01G4/012

Abstract: Disclosed herein is an electronic component that includes a substrate; and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of a predetermined one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part. The recessed part is covered with a first dielectric film made of an inorganic insulating material.

公开(公告)号：US20240038754A1

公开(公告)日：2024-02-01

申请号：US18256301

申请日：2021-12-09

Applicant: TDK Corporation

Inventor： Yukio MITAKE ,  Takashi OHTSUKA

IPC: H01L27/01

CPC classification number: H01L27/01

Abstract: To reduce the chip size of a chip-type electronic component including a capacitor and an inductor. A chip-type electronic component includes a capacitor constituted by a lower electrode pattern, an upper electrode pattern, and an insulating layer, an insulating layer covering the capacitor, and an inductor pattern disposed on the insulating layer. The inductor pattern has a section overlapping the capacitor, whereby an auxiliary capacitor is added. The inductor pattern is thus made to partly overlap the capacitor, so that a larger inductance can be obtained with a small chip size. In addition, characteristics can also be improved by auxiliary capacitance.

公开(公告)号：US20230317352A1

公开(公告)日：2023-10-05

申请号：US18191374

申请日：2023-03-28

Applicant: TDK CORPORATION

Inventor： Takeshi OOHASHI ,  Michiyuki NAKAZAWA ,  Takashi OHTSUKA

IPC: H01F27/28 ,  H01F27/40

CPC classification number: H01F27/2804 ,  H01F27/402 ,  H01F2027/2809

Abstract: In an electronic component, a first inductor and a second inductor are disposed side by side in a first direction, and in a region where the first inductor and the second inductor are adjacent to each other in the first direction, at least one of positions in a second direction of an upper surface of a first inductor pattern, and an upper surface of a second inductor pattern and positions in the second direction of a lower surface of the first inductor pattern and a lower surface of a second inductor pattern, are different.

公开(公告)号：US20230371175A1

公开(公告)日：2023-11-16

申请号：US18044869

申请日：2021-09-13

Applicant: TDK Corporation

Inventor： Yu FUKAE ,  Tomoya HANAI ,  Yusuke OBA ,  Kenichi YOSHIDA ,  Katsuharu YASUDA ,  Takashi OHTSUKA

IPC: H05K1/02 ,  H05K1/05

CPC classification number: H05K1/0298 ,  H05K1/05 ,  H05K2201/0338 ,  H05K2201/09409

Abstract: To prevent interfacial peeling due to the stress of an insulating layer in a capacitor-inductor integrated electronic component having three or more conductor layers. An electronic component includes: a conductor layer M1 including a conductor pattern constituting an inductor; a conductor pattern overlapping a part of the conductor pattern through a dielectric film; an insulating layer covering the conductor layer M1 and conductor pattern; a conductor layer M2 provided on the insulating layer and including a conductor pattern constituting the inductor; and an insulating layer covering the conductor layer M2. The conductor layer M2 is formed to be branching from or independently of the conductor pattern and further includes a dummy pattern overlapping the conductor pattern. This prevents the stress of the insulating layer from being directly applied to the conductor pattern to thereby prevent peeling at the interface between the conductor layer M1 and the dielectric film.

公开(公告)号：US20210305231A1

公开(公告)日：2021-09-30

申请号：US17206656

申请日：2021-03-19

Applicant: TDK CORPORATION

Inventor： Yusuke OBA ,  Kenichi YOSHIDA ,  Takashi OHTSUKA ,  Yuichiro OKUYAMA ,  Tomoya HANAI ,  Yu FUKAE

IPC: H01L27/01 ,  H01L21/78 ,  H01L21/70

Abstract: Disclosed herein is an electronic component that includes a substrate, a functional layer formed on the substrate and having a plurality of alternately stacked conductor layers and insulating layers, and a plurality of terminal electrodes provided on an uppermost one of the insulating layers. The uppermost one of the insulating layers has a substantially rectangular planar shape and has a protruding part protruding in a planar direction from at least one side in a plan view.

公开(公告)号：US20200211782A1

公开(公告)日：2020-07-02

申请号：US16724760

申请日：2019-12-23

Applicant: TDK CORPORATION

Inventor： Yoshihiro SHINKAI ,  Yuichiro OKUYAMA ,  Tomoya HANAI ,  Yusuke ARIAKE ,  Isao KANADA ,  Takashi OHTSUKA

IPC: H01G4/40 ,  H01F27/24 ,  H01F27/40 ,  H01F27/28

Abstract: An LC composite component includes a non-magnetic substrate, a magnetic layer with magnetism, capacitors, inductors, and core parts with magnetism. The non-magnetic substrate includes a first surface and a second surface on a side opposite to the first surface. The magnetic layer is disposed to face the first surface of the non-magnetic substrate. The inductors and the capacitors are disposed between the first surface of the non-magnetic substrate and the magnetic layer. The core parts are disposed between the first surface of the non-magnetic substrate and the magnetic layer and connected to the magnetic layer. The thickness of the core parts is 1.0 or more times the thickness of the magnetic layer in a direction perpendicular to the first surface of the non-magnetic substrate, and each of the magnetic layer and the core parts contains magnetic metal particles and resin.

公开(公告)号：US20230397338A1

公开(公告)日：2023-12-07

申请号：US18449095

申请日：2023-08-14

Applicant: TDK Corporation

Inventor： Atsuhiro TSUYOSHI ,  Takashi OHTSUKA ,  Kenichi YOSHIDA

IPC: H05K1/18 ,  H05K3/30 ,  H05K3/46

CPC classification number: H05K1/188 ,  H05K3/305 ,  H05K3/4644 ,  H05K2201/0183

Abstract: An electronic component has: a conductor layer M1 formed on a substrate and including lower electrodes of a capacitor; a dielectric film covering the top and side surfaces of each of the lower electrodes; upper electrodes of the capacitor which are formed on the top surfaces of the respective lower electrodes through the dielectric film; and an adhesive film disposed between the dielectric film and the top and side surfaces of each of the lower electrodes. The adhesive film is thus disposed between the dielectric film and the top and side surfaces of each of the lower electrodes.

公开(公告)号：US20230005667A1

公开(公告)日：2023-01-05

申请号：US17784857

申请日：2020-12-04

Applicant: TDK Corporation

Inventor： Kazuhiro YOSHIKAWA ,  Kenichi YOSHIDA ,  Takashi OHTSUKA

IPC: H01G4/224 ,  H01G4/40 ,  H01G4/30 ,  H01G4/08

Abstract: An electronic component includes: a conductive pattern provided on the main surface of a substrate and constituting a lower electrode; a dielectric film that covers top and side surfaces of the conductive pattern; and a conductive pattern stacked on the top surface of the conductive pattern through the dielectric film and constituting an upper electrode. A part of the dielectric film that is parallel to the main surface of the substrate is removed at least partly. Partially removing a part of the dielectric film that is parallel to the main surface of the substrate allows stress relaxation. This prevents peeling at the interface between the lower electrode and the dielectric film.

公开(公告)号：US20210407737A1

公开(公告)日：2021-12-30

申请号：US17330929

申请日：2021-05-26

Applicant: TDK CORPORATION

Inventor： Hajime KUWAJIMA ,  Takashi OHTSUKA ,  Takeshi OOHASHI ,  Yuichiro OKUYAMA

IPC: H01G4/18 ,  H01G4/40 ,  H01G4/228

Abstract: Disclosed herein is an electronic component that includes a substrate, a planarizing layer covering a surface of the substrate, a first conductive layer formed on the planarizing layer and having a lower electrode, a dielectric film made of a material different from that of the planarizing layer and covering the planarizing layer and first conductive layer, an upper electrode laminated on the lower electrode through the dielectric film, and a first insulating layer covering the first conductive layer, dielectric film, and upper electrode. An outer periphery of the first insulating layer directly contacts the planarizing layer without an intervention of the dielectric film.

公开(公告)号：US20200211749A1

公开(公告)日：2020-07-02

申请号：US16725581

申请日：2019-12-23

Applicant: TDK Corporation

Inventor： Yoshihiro SHINKAI ,  Yuichiro OKUYAMA ,  Yusuke ARIAKE ,  Tomoya HANAI ,  Isao KANADA ,  Takashi OHTSUKA

IPC: H01F17/00 ,  H03H7/01 ,  H01F27/29 ,  H05K1/18

Abstract: An LC composite component includes a magnetic substrate with magnetism, a magnetic layer with magnetism, inductors, capacitors, and core parts with magnetism. The magnetic substrate includes a first surface and a second surface on a side opposite to the first surface. The magnetic layer is disposed to face the first surface of the magnetic substrate. The inductors and the capacitors are disposed between the first surface of the magnetic substrate and the magnetic layer. The core parts are disposed between the first surface of the magnetic substrate and the magnetic layer and connected to the magnetic layer. The thickness of the core part is 1.0 or more times the thickness of the magnetic layer, the thickness of the magnetic substrate is 1.0 or more times the thickness of the magnetic layer.