Invention Grant
- Patent Title: Electronic component and manufacturing method therefor
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Application No.: US17206656Application Date: 2021-03-19
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Publication No.: US11776947B2Publication Date: 2023-10-03
- Inventor: Yusuke Oba , Kenichi Yoshida , Takashi Ohtsuka , Yuichiro Okuyama , Tomoya Hanai , Yu Fukae
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: YOUNG LAW FIRM, P.C.
- Priority: JP 20054874 2020.03.25
- Main IPC: H01L25/18
- IPC: H01L25/18 ; H01L27/01 ; H01L21/70 ; H01L21/78 ; H01L49/02

Abstract:
Disclosed herein is an electronic component that includes a substrate, a functional layer formed on the substrate and having a plurality of alternately stacked conductor layers and insulating layers, and a plurality of terminal electrodes provided on an uppermost one of the insulating layers. The uppermost one of the insulating layers has a substantially rectangular planar shape and has a protruding part protruding in a planar direction from at least one side in a plan view.
Public/Granted literature
- US20210305231A1 ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR Public/Granted day:2021-09-30
Information query
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