- 专利标题: Wafer Bin Map Based Root Cause Analysis
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申请号: US17246397申请日: 2021-04-30
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公开(公告)号: US20210342993A1公开(公告)日: 2021-11-04
- 发明人: Tomonori Honda , Lin Lee Cheong , Richard Burch , Qing Zhu , Jeffrey Drue David , Michael Keleher
- 申请人: PDF Solutions, Inc.
- 申请人地址: US CA Santa Clara
- 专利权人: PDF Solutions, Inc.
- 当前专利权人: PDF Solutions, Inc.
- 当前专利权人地址: US CA Santa Clara
- 主分类号: G06T7/00
- IPC分类号: G06T7/00 ; G06F11/07
摘要:
A template for assigning the most probable root causes for wafer defects. The bin map data for a subject wafer can be compared with bin map data for prior wafers to find wafers with similar issues. A probability can be determined as to whether the same root cause should be applied to the subject wafer, and if so, the wafer can be labeled with that root cause accordingly.
公开/授权文献
- US11763446B2 Wafer bin map based root cause analysis 公开/授权日:2023-09-19
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