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公开(公告)号：US20220327268A9
公开(公告)日：2022-10-13
申请号：US17303666
申请日：2021-06-04
申请人： PDF Solutions, Inc.
摘要： A robust predictive model. A plurality of different predictive models for a target feature are run, and a comparative analysis provided for each predictive model that meet minimum performance criteria for the target feature. One of the predictive models is selected, either manually or automatically, based on predefined criteria. For semi-automatic selection, a static or dynamic survey is generated for obtaining user preferences for parameters associated with the target feature. The survey results will be used to generate a model that illustrates parameter trade-offs, which will be used to finalize the optimal predictive model for the user.
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公开(公告)号：US11295993B2
公开(公告)日：2022-04-05
申请号：US17002250
申请日：2020-08-25
申请人： PDF Solutions, Inc.
摘要： A maintenance tool for semiconductor process equipment and components. Sensor data is evaluated by machine learning tools to determine when to schedule maintenance action.
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公开(公告)号：US20210342993A1
公开(公告)日：2021-11-04
申请号：US17246397
申请日：2021-04-30
申请人： PDF Solutions, Inc.
发明人： Tomonori Honda , Lin Lee Cheong , Richard Burch , Qing Zhu , Jeffrey Drue David , Michael Keleher
摘要： A template for assigning the most probable root causes for wafer defects. The bin map data for a subject wafer can be compared with bin map data for prior wafers to find wafers with similar issues. A probability can be determined as to whether the same root cause should be applied to the subject wafer, and if so, the wafer can be labeled with that root cause accordingly.
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公开(公告)号：US11609812B2
公开(公告)日：2023-03-21
申请号：US17064422
申请日：2020-10-06
申请人： PDF Solutions, Inc.
发明人： Richard Burch , Jeffrey D. David , Qing Zhu , Tomonori Honda , Lin Lee Cheong
摘要： Scheme for detection and classification of semiconductor equipment faults. Sensor traces are monitored and processed to separate known abnormal operating conditions from unknown abnormal operating conditions. Feature engineering permits focus on relevant traces for a targeted feature. A machine learning model is built to detect and classify based on an initial classification set of anomalies. The machine learning model is continuously updated as more traces are processed and learned.
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公开(公告)号：US11029359B2
公开(公告)日：2021-06-08
申请号：US16297403
申请日：2019-03-08
申请人： PDF Solutions, Inc.
IPC分类号： G01R31/3183 , G06N20/00 , G06F30/30
摘要： A model is generated for predicting failures at the wafer production level. Input data from sensors is stored as an initial dataset, then data exhibiting excursions or useless impact is removed from the dataset. The dataset is converted into target features, where the target features are useful in predicting whether a wafer will be normal or not. A trade-off between positive and negative results is selected, and a plurality of predictive models are created. The final model is selected based on the trade-off criteria, and deployed.
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公开(公告)号：US20210142122A1
公开(公告)日：2021-05-13
申请号：US17070520
申请日：2020-10-14
申请人： PDF Solutions, Inc.
发明人： Tomonori Honda , Richard Burch , John Kibarian , Lin Lee Cheong , Qing Zhu , Vaishnavi Reddipalli , Kenneth Harris , Said Akar , Jeffrey D David , Michael Keleher , Brian Stein , Dennis Ciplickas
摘要： Classifying wafers using Collaborative Learning. An initial wafer classification is determined by a rule-based model. A predicted wafer classification is determined by a machine learning model. Multiple users can manually review the classifications to confirm or modify, or to add user classifications. All of the classifications are input to the machine learning model to continuously update its scheme for detection and classification.
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公开(公告)号：US20210103489A1
公开(公告)日：2021-04-08
申请号：US17064422
申请日：2020-10-06
申请人： PDF Solutions, Inc.
发明人： Richard Burch , Jeffrey D. David , Qing Zhu , Tomonori Honda , Lin Lee Cheong
摘要： Scheme for detection and classification of semiconductor equipment faults. Sensor traces are monitored and processed to separate known abnormal operating conditions from unknown abnormal operating conditions. Feature engineering permits focus on relevant traces for a targeted feature. A machine learning model is built to detect and classify based on an initial classification set of anomalies. The machine learning model is continuously updated as more traces are processed and learned.
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公开(公告)号：US20210294950A1
公开(公告)日：2021-09-23
申请号：US17303666
申请日：2021-06-04
申请人： PDF Solutions, Inc.
摘要： A robust predictive model. A plurality of different predictive models for a target feature are run, and a comparative analysis provided for each predictive model that meet minimum performance criteria for the target feature. One of the predictive models is selected, either manually or automatically, based on predefined criteria. For semi-automatic selection, a static or dynamic survey is generated for obtaining user preferences for parameters associated with the target feature. The survey results will be used to generate a model that illustrates parameter trade-offs, which will be used to finalize the optimal predictive model for the user.
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公开(公告)号：US11022642B2
公开(公告)日：2021-06-01
申请号：US16112278
申请日：2018-08-24
申请人： PDF Solutions, Inc.
摘要： A method for predicting yield for a semiconductor process. A particular type of wafer is fabricated to have a first set of features disposed on the wafer, with a wafer map identifying a location for each of the first set of features on the wafer. Data from wafer acceptance tests and circuit probe tests is collected over time for wafers of that particular type as made in a semiconductor fabrication process, and at least one training dataset and a least one validation dataset are created from the collected data. A second set of “engineered” features are created and also incorporated onto the wafer and wafer map. Important features from the first and second sets of features are identified and selected, and using those important features as inputs, a number of different process models are run, with yield as the target. The results of the different models can be combined, for example, statistically.
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公开(公告)号：US10777470B2
公开(公告)日：2020-09-15
申请号：US16365538
申请日：2019-03-26
申请人： PDF Solutions, Inc.
摘要： Testing data is evaluated by machine learning tools to determine whether to include or exclude chips from further testing.
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