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公开(公告)号：US11295993B2
公开(公告)日：2022-04-05
申请号：US17002250
申请日：2020-08-25
申请人： PDF Solutions, Inc.
摘要： A maintenance tool for semiconductor process equipment and components. Sensor data is evaluated by machine learning tools to determine when to schedule maintenance action.
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公开(公告)号：US20230377132A1
公开(公告)日：2023-11-23
申请号：US18365157
申请日：2023-08-03
申请人： PDF Solutions, Inc.
发明人： Tomonori Honda , Lin Lee Cheong , Richard Burch , Qing Zhu , Jeffrey Drue David , Michael Keleher
CPC分类号： G06T7/001 , G06F11/079 , G06T2207/30148
摘要： A template for assigning the most probable root causes for wafer defects. The bin map data for a subject wafer can be compared with bin map data for prior wafers to find wafers with similar issues. A probability can be determined as to whether the same root cause should be applied to the subject wafer, and if so, the wafer can be labeled with that root cause accordingly.
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公开(公告)号：US20220066410A1
公开(公告)日：2022-03-03
申请号：US17459657
申请日：2021-08-27
申请人： PDF Solutions, Inc.
IPC分类号： G05B19/18 , G05B19/406
摘要： Wafer quality is determined by modeling equipment history as a sequence of events, then evaluating anomalous results for individual events. Identifying an event that generates bad wafers narrows the list of possible root causes.
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公开(公告)号：US20210342993A1
公开(公告)日：2021-11-04
申请号：US17246397
申请日：2021-04-30
申请人： PDF Solutions, Inc.
发明人： Tomonori Honda , Lin Lee Cheong , Richard Burch , Qing Zhu , Jeffrey Drue David , Michael Keleher
摘要： A template for assigning the most probable root causes for wafer defects. The bin map data for a subject wafer can be compared with bin map data for prior wafers to find wafers with similar issues. A probability can be determined as to whether the same root cause should be applied to the subject wafer, and if so, the wafer can be labeled with that root cause accordingly.
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公开(公告)号：US11763446B2
公开(公告)日：2023-09-19
申请号：US17246397
申请日：2021-04-30
申请人： PDF Solutions, Inc.
发明人： Tomonori Honda , Lin Lee Cheong , Richard Burch , Qing Zhu , Jeffrey Drue David , Michael Keleher
CPC分类号： G06T7/001 , G06F11/079 , G06T2207/30148
摘要： A template for assigning the most probable root causes for wafer defects. The bin map data for a subject wafer can be compared with bin map data for prior wafers to find wafers with similar issues. A probability can be determined as to whether the same root cause should be applied to the subject wafer, and if so, the wafer can be labeled with that root cause accordingly.
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公开(公告)号：US11029673B2
公开(公告)日：2021-06-08
申请号：US16006614
申请日：2018-06-12
申请人： PDF Solutions, Inc.
IPC分类号： G05B19/418 , H01L21/67 , G05B13/02
摘要： Robust machine learning predictions. Temporal dependencies of process targets for different machine learning models can be captured and evaluated for the impact on process performance for target. The most robust of these different models is selected for deployment based on minimizing variance for the desired performance characteristic.
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公开(公告)号：US11972552B2
公开(公告)日：2024-04-30
申请号：US17237516
申请日：2021-04-22
申请人： PDF Solutions, Inc.
发明人： Tomonori Honda , Richard Burch , Qing Zhu , Jeffrey Drue David
IPC分类号： G06K9/62 , G06F18/2415 , G06F18/2431 , G06N5/04 , G06N20/00 , G06T7/00 , G06V10/44 , G06V10/764 , G06V10/82
CPC分类号： G06T7/0004 , G06F18/2415 , G06F18/2431 , G06N5/04 , G06N20/00 , G06V10/454 , G06V10/764 , G06V10/82 , G06T2207/20076 , G06T2207/30148
摘要： A semiconductor image classifier. Convolution functions are applied to modify the wafer images in order to extract key information about the image. The modified images are condensed then processed through a series of pairwise classifiers, each classifier configured to determine that the image is more like one of the pair than the other. Probabilities from each classifier are collected to form a prediction for each image.
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公开(公告)号：US20210334608A1
公开(公告)日：2021-10-28
申请号：US17237516
申请日：2021-04-22
申请人： PDF Solutions, Inc.
发明人： Tomonori Honda , Richard Burch , Qing Zhu , Jeffrey Drue David
摘要： A semiconductor image classifier. Convolution functions are applied to modify the wafer images in order to extract key information about the image. The modified images are condensed then processed through a series of pairwise classifiers, each classifier configured to determine that the image is more like one of the pair than the other. Probabilities from each classifier are collected to form a prediction for each image.
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公开(公告)号：US11022642B2
公开(公告)日：2021-06-01
申请号：US16112278
申请日：2018-08-24
申请人： PDF Solutions, Inc.
摘要： A method for predicting yield for a semiconductor process. A particular type of wafer is fabricated to have a first set of features disposed on the wafer, with a wafer map identifying a location for each of the first set of features on the wafer. Data from wafer acceptance tests and circuit probe tests is collected over time for wafers of that particular type as made in a semiconductor fabrication process, and at least one training dataset and a least one validation dataset are created from the collected data. A second set of “engineered” features are created and also incorporated onto the wafer and wafer map. Important features from the first and second sets of features are identified and selected, and using those important features as inputs, a number of different process models are run, with yield as the target. The results of the different models can be combined, for example, statistically.
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公开(公告)号：US10777470B2
公开(公告)日：2020-09-15
申请号：US16365538
申请日：2019-03-26
申请人： PDF Solutions, Inc.
摘要： Testing data is evaluated by machine learning tools to determine whether to include or exclude chips from further testing.
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