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公开(公告)号：US12038802B2
公开(公告)日：2024-07-16
申请号：US17070520
申请日：2020-10-14
Applicant: PDF Solutions, Inc.
Inventor： Tomonori Honda , Richard Burch , John Kibarian , Lin Lee Cheong , Qing Zhu , Vaishnavi Reddipalli , Kenneth Harris , Said Akar , Jeffrey D David , Michael Keleher , Brian Stine , Dennis Ciplickas
IPC: G06N20/00 , G06F11/07 , G06F18/211 , G06F18/241 , G06F18/40 , H01L21/02 , G06F3/0482 , G06N3/08 , G06N7/01
CPC classification number: G06F11/079 , G06F11/0736 , G06F11/0751 , G06F11/0778 , G06F18/211 , G06F18/241 , G06F18/40 , G06N20/00 , H01L21/02 , G06F3/0482 , G06N3/08 , G06N7/01
Abstract: Classifying wafers using Collaborative Learning. An initial wafer classification is determined by a rule-based model. A predicted wafer classification is determined by a machine learning model. Multiple users can manually review the classifications to confirm or modify, or to add user classifications. All of the classifications are input to the machine learning model to continuously update its scheme for detection and classification.
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公开(公告)号：US12229945B2
公开(公告)日：2025-02-18
申请号：US18365157
申请日：2023-08-03
Applicant: PDF Solutions, Inc.
Inventor： Tomonori Honda , Lin Lee Cheong , Richard Burch , Qing Zhu , Jeffrey Drue David , Michael Keleher
Abstract: A template for assigning the most probable root causes for wafer defects. The bin map data for a subject wafer can be compared with bin map data for prior wafers to find wafers with similar issues. A probability can be determined as to whether the same root cause should be applied to the subject wafer, and if so, the wafer can be labeled with that root cause accordingly.
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公开(公告)号：US11763446B2
公开(公告)日：2023-09-19
申请号：US17246397
申请日：2021-04-30
Applicant: PDF Solutions, Inc.
Inventor： Tomonori Honda , Lin Lee Cheong , Richard Burch , Qing Zhu , Jeffrey Drue David , Michael Keleher
CPC classification number: G06T7/001 , G06F11/079 , G06T2207/30148
Abstract: A template for assigning the most probable root causes for wafer defects. The bin map data for a subject wafer can be compared with bin map data for prior wafers to find wafers with similar issues. A probability can be determined as to whether the same root cause should be applied to the subject wafer, and if so, the wafer can be labeled with that root cause accordingly.
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公开(公告)号：US11609812B2
公开(公告)日：2023-03-21
申请号：US17064422
申请日：2020-10-06
Applicant: PDF Solutions, Inc.
Inventor： Richard Burch , Jeffrey D. David , Qing Zhu , Tomonori Honda , Lin Lee Cheong
Abstract: Scheme for detection and classification of semiconductor equipment faults. Sensor traces are monitored and processed to separate known abnormal operating conditions from unknown abnormal operating conditions. Feature engineering permits focus on relevant traces for a targeted feature. A machine learning model is built to detect and classify based on an initial classification set of anomalies. The machine learning model is continuously updated as more traces are processed and learned.
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公开(公告)号：US20210142122A1
公开(公告)日：2021-05-13
申请号：US17070520
申请日：2020-10-14
Applicant: PDF Solutions, Inc.
Inventor： Tomonori Honda , Richard Burch , John Kibarian , Lin Lee Cheong , Qing Zhu , Vaishnavi Reddipalli , Kenneth Harris , Said Akar , Jeffrey D David , Michael Keleher , Brian Stein , Dennis Ciplickas
Abstract: Classifying wafers using Collaborative Learning. An initial wafer classification is determined by a rule-based model. A predicted wafer classification is determined by a machine learning model. Multiple users can manually review the classifications to confirm or modify, or to add user classifications. All of the classifications are input to the machine learning model to continuously update its scheme for detection and classification.
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Patent Agency Ranking
公开(公告)号：US20210103489A1
公开(公告)日：2021-04-08
申请号：US17064422
申请日：2020-10-06
Applicant: PDF Solutions, Inc.
Inventor： Richard Burch , Jeffrey D. David , Qing Zhu , Tomonori Honda , Lin Lee Cheong
Abstract: Scheme for detection and classification of semiconductor equipment faults. Sensor traces are monitored and processed to separate known abnormal operating conditions from unknown abnormal operating conditions. Feature engineering permits focus on relevant traces for a targeted feature. A machine learning model is built to detect and classify based on an initial classification set of anomalies. The machine learning model is continuously updated as more traces are processed and learned.
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公开(公告)号：US20230377132A1
公开(公告)日：2023-11-23
申请号：US18365157
申请日：2023-08-03
Applicant: PDF Solutions, Inc.
Inventor： Tomonori Honda , Lin Lee Cheong , Richard Burch , Qing Zhu , Jeffrey Drue David , Michael Keleher
CPC classification number: G06T7/001 , G06F11/079 , G06T2207/30148
Abstract: A template for assigning the most probable root causes for wafer defects. The bin map data for a subject wafer can be compared with bin map data for prior wafers to find wafers with similar issues. A probability can be determined as to whether the same root cause should be applied to the subject wafer, and if so, the wafer can be labeled with that root cause accordingly.
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公开(公告)号：US20210342993A1
公开(公告)日：2021-11-04
申请号：US17246397
申请日：2021-04-30
Applicant: PDF Solutions, Inc.
Inventor： Tomonori Honda , Lin Lee Cheong , Richard Burch , Qing Zhu , Jeffrey Drue David , Michael Keleher
Abstract: A template for assigning the most probable root causes for wafer defects. The bin map data for a subject wafer can be compared with bin map data for prior wafers to find wafers with similar issues. A probability can be determined as to whether the same root cause should be applied to the subject wafer, and if so, the wafer can be labeled with that root cause accordingly.
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公开(公告)号：US12223012B2
公开(公告)日：2025-02-11
申请号：US17072830
申请日：2020-10-16
Applicant: PDF Solutions, Inc.
Inventor： Richard Burch , Qing Zhu , Jonathan Holt , Tomonori Honda
IPC: G06N20/00 , G06F17/18 , G06F18/2113 , G06N5/04
Abstract: A sequence of models accumulates r-squared values for an increasing number of variables in order to quantify the importance of each variable to the prediction of a targeted yield or parametric response.
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公开(公告)号：US11640160B2
公开(公告)日：2023-05-02
申请号：US17395632
申请日：2021-08-06
Applicant: PDF Solutions, Inc.
Inventor： Richard Burch , Qing Zhu
IPC: G05B19/418
Abstract: Enhancement of less dominant patterns for parametric wafer measurements. Dominant patterns are removed from the parametric pattern thereby revealing a less dominant pattern. The less dominant patterns can be used to identify root causes for yield loss that are not visible in the original parametric measurements.
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