Invention Application
- Patent Title: Base Plate for a Semiconductor Module Arrangement and Method for Producing a Base Plate
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Application No.: US17362076Application Date: 2021-06-29
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Publication No.: US20220005708A1Publication Date: 2022-01-06
- Inventor: Marco Rasel , Elvis Keli
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Priority: EP20184207.7 20200706
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/13 ; H01L23/498 ; H01L23/367

Abstract:
A method comprises producing a base plate, wherein producing the base plate comprises forming a layer of a metallic material, and forming at least one first area in the layer of metallic material, wherein forming the at least one first area either comprises locally deforming the layer of metallic material, or locally inducing stress into the layer of metallic material, or both such that a deflection or a local stress or both in the at least one first area differs from a deflection or a local stress or both of those areas of the metallic layer surrounding the at least one first area.
Information query
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