Invention Application
- Patent Title: PART-LIFE ESTIMATION UTILIZING FEATURE METROLOGY
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Application No.: US16933922Application Date: 2020-07-20
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Publication No.: US20220020565A1Publication Date: 2022-01-20
- Inventor: Chien-Min LIAO , Yao-Hung YANG , Tom K. CHO , Siamak SALIMIAN , Hsiu YANG , Chun-Chung CHEN
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01J37/32
- IPC: H01J37/32

Abstract:
Certain embodiments provide a method and non-transitory computer readable medium comprising instructions that, when executed by a processor of a processing system, cause the processing system to perform a method for improving operation of a semiconductor processing system. The method of part life estimation generally includes obtaining a chamber part having a first surface portion and second surface portion. A data matrix in the first portion of the chamber part is read. The data matrix has raised features. The first portion of the chamber part is cleaned. Wear on the raised features is evaluated. The part is discarded in response to the wear on the raised feature.
Public/Granted literature
- US11532466B2 Part-life estimation utilizing feature metrology Public/Granted day:2022-12-20
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