公开(公告)号：US20250073819A1

公开(公告)日：2025-03-06

申请号：US18242184

申请日：2023-09-05

Applicant: Applied Materials, Inc.

Inventor： Chunrong YIN ,  Ching-Pao WANG ,  Joseph LIU ,  Yixing LIN ,  Boon Sen CHAN ,  Siamak SALIMIAN

IPC: B23K26/352 ,  B23K26/082 ,  B23K26/40

Abstract: Methods and apparatus for cleaning a used component from a substrate processing chamber are provided. In some embodiments, the method includes obtaining a used component having a ceramic base and process residue that is generated as a byproduct in the substrate processing chamber and that is in direct contact with the ceramic base; and at least partially removing the process residue by scanning a laser beam across the process residue.

公开(公告)号：US20220020565A1

公开(公告)日：2022-01-20

申请号：US16933922

申请日：2020-07-20

Applicant: Applied Materials, Inc.

Inventor： Chien-Min LIAO ,  Yao-Hung YANG ,  Tom K. CHO ,  Siamak SALIMIAN ,  Hsiu YANG ,  Chun-Chung CHEN

IPC: H01J37/32

Abstract: Certain embodiments provide a method and non-transitory computer readable medium comprising instructions that, when executed by a processor of a processing system, cause the processing system to perform a method for improving operation of a semiconductor processing system. The method of part life estimation generally includes obtaining a chamber part having a first surface portion and second surface portion. A data matrix in the first portion of the chamber part is read. The data matrix has raised features. The first portion of the chamber part is cleaned. Wear on the raised features is evaluated. The part is discarded in response to the wear on the raised feature.

公开(公告)号：US20220275505A1

公开(公告)日：2022-09-01

申请号：US17187218

申请日：2021-02-26

Applicant: Applied Materials, Inc.

Inventor： Chien-Min LIAO ,  Chi-Feng LIU ,  Yi Nung WU ,  Hsiu YANG ,  Yixing LIN ,  Boon Sen CHAN ,  Siamak SALIMIAN

IPC: C23C16/44 ,  H05B1/02 ,  C23C16/455

Abstract: Methods and apparatus for a baking chamber for processing a chamber component are provided herein. In some embodiments, a baking chamber includes: an enclosure defining a first chamber, wherein the first chamber comprises: a first chamber body having a first floor and first sidewalls that couple the first floor to a first lid of the first chamber body to define a first interior volume; a first support disposed in the first interior volume; a first gas line disposed in the first interior volume proximate the first lid; a first showerhead disposed between the first gas line and the first support; a first exhaust coupled to the first floor; and a first heater disposed in the first interior volume between the first support and the first floor; and wherein the enclosure includes a door configured to facilitate transferring the chamber component into and out of the enclosure.

公开(公告)号：US20210168979A1

公开(公告)日：2021-06-03

申请号：US16702031

申请日：2019-12-03

Applicant: Applied Materials, Inc.

Inventor： Hsui YANG ,  Yao-Hung YANG ,  Jeevan SHANBHAG ,  Chien-Min LIAO ,  Earl HUNTER ,  David GANON ,  Mariana LUIGI ,  Siamak SALIMIAN ,  Tom K. CHO ,  Chun-Chung CHEN

IPC: H05K13/08 ,  H01L21/67

Abstract: The present disclosure is directed to a system and method to identify and track parts of a semiconductor processing chamber, as well as the status of the parts, and store status information in a centralized location as status changes over time.

公开(公告)号：US20200079044A1

公开(公告)日：2020-03-12

申请号：US16123637

申请日：2018-09-06

Applicant: Applied Materials, Inc.

Inventor： Shagun P. MAHESHWARI ,  Yao-Hung YANG ,  Tom K. CHO ,  Yu-Chi YEH ,  Andrew YU ,  Aniruddha PAL ,  Siamak SALIMIAN

IPC: B29D99/00 ,  F16J15/328 ,  F16J15/3284

Abstract: A method of reclaiming a used seal includes boiling the used seal in a liquid, and after boiling the used seal in the liquid, baking the used seal. The boiling the used seal may include boiling for a predetermined boiling time in the liquid, and the baking the used seal may include baking the used seal for a predetermined bake time at a predetermined temperature.

公开(公告)号：US20240353010A1

公开(公告)日：2024-10-24

申请号：US18138396

申请日：2023-04-24

Applicant: Applied Materials, Inc.

Inventor： Chih-Yang CHANG ,  Kaushik RAO ,  Yao-Hung YANG ,  Tom K. CHO ,  Siamak SALIMIAN

IPC: F16K3/02 ,  B33Y10/00 ,  B33Y80/00

CPC classification number: F16K3/0227 ,  B33Y10/00 ,  B33Y80/00 ,  F16K3/0281

Abstract: Embodiments of methods of fabricating and refurbishing a component having a seal are provided. A method of fabricating a component having a seal includes: depositing a first layer directly onto a sealing surface of a body, wherein the first layer includes a 3D surface pattern; and depositing a second layer onto the first layer, wherein the second layer includes a seal material. A method of refurbishing a component having a seal includes: providing a component including a body and a seal attached to the body; removing at least a portion the seal from a sealing surface of the body to form an exposed portion of the sealing surface; depositing a first layer directly onto the exposed portion of the sealing surface, wherein the first layer includes a 3D surface pattern; and depositing a second layer onto the first layer, wherein the a second layer includes seal material.

公开(公告)号：US20230238267A1

公开(公告)日：2023-07-27

申请号：US17584503

申请日：2022-01-26

Applicant: Applied Materials, Inc.

Inventor： Ramesh GOPALAN ,  Robert Toshiharu HIRAHARA ,  Stanley WU ,  Michael Prestoza DECENA ,  Wendell BOYD ,  Siamak SALIMIAN ,  Thomas BREZOCZKY

IPC: H01L21/683 ,  H01L21/687 ,  H01L21/304

CPC classification number: H01L21/6833 ,  H01L21/68757 ,  H01L21/304

Abstract: Methods and apparatus reduce chucking abnormalities for electrostatic chucks by ensuring proper planarizing of ceramic surfaces of the electrostatic chuck. In some embodiments, a method for planarizing an upper ceramic surface of an electrostatic chuck assembly may comprise placing the electrostatic chuck assembly in a first planarizing apparatus, altering an upper ceramic surface of the electrostatic chuck assembly, and halting the altering of the upper ceramic surface of the electrostatic chuck assembly when an Sa parameter is less than approximately 0.1 microns, an Sdr parameter is less than approximately 2.5 percent, an Sz parameter is less than approximately 10 microns for any given area of approximately 10 mm2 of the upper ceramic surface, or a pit-porosity depth parameter of greater than 1 micron is less than approximately 0.1 percent of area of the upper ceramic surface.

公开(公告)号：US20210159060A1

公开(公告)日：2021-05-27

申请号：US16697591

申请日：2019-11-27

Applicant: Applied Materials, Inc.

Inventor： Ramesh GOPALAN ,  Siamak SALIMIAN

IPC: H01J37/32 ,  C23C16/50 ,  G01N21/61

Abstract: Embodiments of the present invention provide apparatus, systems and methods for measuring dissociation of a process gas generated by a RPS. In one embodiment, a method of measuring dissociation of a process gas includes receiving a process gas from a RPS, the process gas including a polyatomic molecule that dissociates into at least one free radical. The method further includes irradiating the process gas with IR radiation at one or more wavelengths, detecting the IR radiation that passes through the process gas, and determining a degree of dissociation of the polyatomic molecule in the process gas based, at least in part, on the detected IR radiation. In one embodiment, the method further comprises modifying one or more settings of the RPS, based, at least in part, on the determined degree of dissociation.