Invention Application
- Patent Title: INORGANIC-BASED EMBEDDED-DIE LAYERS FOR MODULAR SEMICONDUCTIVE DEVICES
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Application No.: US17492476Application Date: 2021-10-01
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Publication No.: US20220028788A1Publication Date: 2022-01-27
- Inventor: Srinivas V. PIETAMBARAM , Tarek IBRAHIM , Kristof DARMAWIKARTA , Rahul N. MANEPALLI , Debendra MALLIK , Robert L. SANKMAN
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/48 ; H01L23/498 ; H01L23/00 ; H01L25/065
Abstract:
A glass substrate houses an embedded multi-die interconnect bridge that is part of a semiconductor device package. Through-glass vias communicate to a surface for mounting on a semiconductor package substrate.
Public/Granted literature
- US11798887B2 Inorganic-based embedded-die layers for modular semiconductive devices Public/Granted day:2023-10-24
Information query
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