Invention Application
- Patent Title: THERMALLY CONDUCTIVE RESIN SHEET
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Application No.: US17423659Application Date: 2020-01-21
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Publication No.: US20220073805A1Publication Date: 2022-03-10
- Inventor: Yuuki HOSHIYAMA
- Applicant: SEKISUI CHEMICAL CO., LTD.
- Applicant Address: JP Osaka
- Assignee: SEKISUI CHEMICAL CO., LTD.
- Current Assignee: SEKISUI CHEMICAL CO., LTD.
- Current Assignee Address: JP Osaka
- Priority: JP2019-008849 20190122,JP2019-008850 20190122,JP2019-008851 20190122
- International Application: PCT/JP2020/001992 WO 20200121
- Main IPC: C09K5/14
- IPC: C09K5/14 ; C08K3/38 ; H01L23/373

Abstract:
The thermally conductive resin sheet of the present invention has a heat conductivity of 7 W/m·K or more, a 30% compressive strength of 1500 kPa or less, and a rate of change of the 30% compressive strength of 30% or less after a heat resistance test in which the thermally conductive resin sheet is heated for 1000 hours at 150° C. According to the present invention, a thermally conductive resin sheet with good heat conductive property and flexibility and long-term stability of physical properties such as not becoming hardened over time can be provided.
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