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公开(公告)号：US20190241786A1
公开(公告)日：2019-08-08
申请号：US16341976
申请日：2017-11-30
IPC分类号： C09K5/14 , C08K3/38 , C08K3/04 , C08J5/18 , H01L23/373 , B32B25/02 , B32B25/04 , B32B25/16 , B32B25/20
CPC分类号： C09K5/14 , B32B7/02 , B32B25/02 , B32B25/042 , B32B25/16 , B32B25/20 , B32B27/18 , B32B2250/248 , B32B2262/105 , B32B2262/106 , B32B2307/302 , B32B2457/14 , C08J5/18 , C08J2309/00 , C08J2309/02 , C08J2323/16 , C08J2383/04 , C08K3/04 , C08K3/042 , C08K3/22 , C08K3/28 , C08K3/34 , C08K3/38 , C08K2003/385 , C08K2201/001 , C08K2201/005 , C08L101/00 , H01L23/36 , H01L23/373 , H01L23/3735 , H01L23/3737 , H05K7/20
摘要： A heat-conducting sheet according to the present invention is a heat-conducting sheet having an initial Asker C hardness of 50 or less, the heat-conducting sheet containing an elastomer resin at the volume proportion of 30 to 70%, and a thermally conductive filler at the volume proportion of 30 to 70%, in which the elastomer resin has a viscosity at 25° C. of 3000 Pa·s or less, and the elastomer resin has a lamella length of 20 mm or more. According to the present invention, a heat-conducting sheet which has initial flexibility sufficient to exhibit excellent shape conformability and in which residual stress is reduced after compression by applying pressure can be provided.
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公开(公告)号：US20220073805A1
公开(公告)日：2022-03-10
申请号：US17423659
申请日：2020-01-21
发明人： Yuuki HOSHIYAMA
IPC分类号： C09K5/14 , C08K3/38 , H01L23/373
摘要： The thermally conductive resin sheet of the present invention has a heat conductivity of 7 W/m·K or more, a 30% compressive strength of 1500 kPa or less, and a rate of change of the 30% compressive strength of 30% or less after a heat resistance test in which the thermally conductive resin sheet is heated for 1000 hours at 150° C. According to the present invention, a thermally conductive resin sheet with good heat conductive property and flexibility and long-term stability of physical properties such as not becoming hardened over time can be provided.
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公开(公告)号：US20240141222A1
公开(公告)日：2024-05-02
申请号：US18280824
申请日：2021-03-10
发明人： Yuuki HOSHIYAMA , Kento TSUCHIYA , Nobuhiko INUI
IPC分类号： C09K5/14 , C08K7/18 , H01L23/373
CPC分类号： C09K5/14 , C08K7/18 , H01L23/3733 , C08K2201/001 , C08K2201/005 , C08K2201/014 , C08K2201/016
摘要： The heat-conducting resin sheet according to an aspect of the present invention comprises a thermally conductive plate-shaped particle, a thermally conductive spherical particle, and a resin, wherein the heat-conducting resin sheet has a thermal conductivity of 5 W/m·K or more and a 30% compressive strength B of 1500 kPa or less as measured at a compression rate of 1.0 mm/min. Furthermore, a volume ratio of the thermally conductive plate-shaped particle to the thermally conductive spherical particle (volume of thermally conductive plate-shaped particle/volume of thermally conductive spherical particle) is 30/70 to 90/10, and the total volume of the thermally conductive plate-shaped particle and the thermally conductive spherical particle is 30 to 90% by volume. According to the present invention, there can be provided a heat-conducting resin sheet that is excellent in the thermal conductivity and flexibility and can suppress the increase in the stress even when compressed quickly.
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公开(公告)号：US20210189032A1
公开(公告)日：2021-06-24
申请号：US16650139
申请日：2018-09-28
发明人： Koji YACHI , Hiroshi HIRAIKE , Yuuki HOSHIYAMA , Izumi OKAMURA , Yasuharu NAGAI , Kazuyuki YAHARA , Ayaha OGURI
IPC分类号： C08F220/12 , C08J9/232
摘要： A shock-absorbing sheet comprises a foamed resin layer having a thickness of 200 μm or less, a void ratio (P0.1) of a plane directional cross section at a thickness of 0.1 T, a void ratio (P0.5) of a plane directional cross section at a thickness of 0.5 T, and a void ratio (P0.9) of a plane directional cross section at a thickness of 0.9 T from one surface of the foamed resin layer each ranging from 10 to 70 area %; and the standard deviation (Pσ) for an average void ratio found from the void ratio (P0.1), the void ratio (P0.5) and the void ratio (P0.9) ranging from 1.0 to 20.
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