Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
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Application No.: US17190827Application Date: 2021-03-03
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Publication No.: US20220076965A1Publication Date: 2022-03-10
- Inventor: Hiroaki MATSUDA , Masayuki KITAMURA
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2020-151576 20200909
- Main IPC: H01L21/3215
- IPC: H01L21/3215 ; H01L27/11582

Abstract:
A semiconductor device includes a stacked body including a plurality of conductive layers insulated from each other, a semiconductor layer extending into the stacked body, and a charge storage layer located between one of the conductive layers and the semiconductor layer. The conductive layer contains tungsten and an auxiliary material. An amount of the auxiliary material is smaller than an amount of tungsten, and an oxide free energy of the auxiliary material is smaller than an oxide free energy of tungsten.
Public/Granted literature
- US1805981A Process of manufacturing fibrous blocks Public/Granted day:1931-05-19
Information query
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