Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
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Application No.: US17428753Application Date: 2020-02-13
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Publication No.: US20220077322A1Publication Date: 2022-03-10
- Inventor: Shunpei YAMAZAKI , Erika TAKAHASHI , Tsutomu MURAKAWA , Shinya SASAGAWA , Katsuaki TOCHIBAYASHI
- Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Current Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Priority: JP2019-030918 20190222,JP2019-042790 20190308
- International Application: PCT/IB2020/051160 WO 20200213
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/04 ; H01L29/66

Abstract:
A semiconductor device with small fluctuations in transistor characteristics can be provided. The semiconductor device includes a first oxide, a second oxide and a third oxide over the first oxide, a first conductor over the second oxide, a second conductor over the third oxide, a fourth oxide over the first oxide and between the second oxide and the third oxide, a first insulator over the fourth oxide, and a third conductor over the first insulator. The first oxide includes a groove in a region not overlapping with the second oxide and the third oxide. The first oxide includes a first layered crystal substantially parallel to the surface where the first oxide is formed. In the groove, the fourth oxide includes a second layered crystal substantially parallel to the surface where the first oxide is formed. A concentration of aluminum atoms at an interface between the first oxide and the fourth oxide and in the vicinity of the interface is less than or equal to 5.0 atomic %.
Public/Granted literature
- US12176439B2 Semiconductor device and method for manufacturing semiconductor device Public/Granted day:2024-12-24
Information query
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