Invention Application
- Patent Title: ELECTRONIC DEVICE HOUSING HAVING A RADIO-FREQUENCY TRANSMISSIVE COMPONENT
-
Application No.: US17469001Application Date: 2021-09-08
-
Publication No.: US20220085843A1Publication Date: 2022-03-17
- Inventor: Daniel R. Bloom , Chelsea E. Wojeski , Edward Siahaan , Nathan Morris , Ryan S. Haley , Tian Shi Li , Toni Ristoski
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Main IPC: H04B1/3827
- IPC: H04B1/3827
Abstract:
An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.
Public/Granted literature
- US11784673B2 Electronic device housing having a radio-frequency transmissive component Public/Granted day:2023-10-10
Information query
