专利检索 ap:("Apple Inc.") AND inv:"Chelsea E. Wojeski" 第 1 页

1.

发明授权
Electronic device housing having a radio-frequency transmissive component 有权

公开(公告)号：US11784673B2

公开(公告)日：2023-10-10

申请号：US17469001

申请日：2021-09-08

申请人： Apple Inc.

发明人： Daniel R. Bloom , Chelsea E. Wojeski , Edward Siahaan , Nathan Morris , Ryan S. Haley , Tian Shi Li , Toni Ristoski

IPC分类号： H04B1/3827

CPC分类号： H04B1/3827

摘要： An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.

2.

发明申请
ELECTRONIC DEVICE HOUSING HAVING A RADIO-FREQUENCY TRANSMISSIVE COMPONENT 有权

公开(公告)号：US20220085843A1

公开(公告)日：2022-03-17

申请号：US17469001

申请日：2021-09-08

申请人： Apple Inc.

发明人： Daniel R. Bloom , Chelsea E. Wojeski , Edward Siahaan , Nathan Morris , Ryan S. Haley , Tian Shi Li , Toni Ristoski

IPC分类号： H04B1/3827

摘要： An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.

3.

发明公开
ELECTRONIC DEVICE HOUSING HAVING A RADIO-FREQUENCY TRANSMISSIVE COMPONENT 审中-公开

公开(公告)号：US20230421196A1

公开(公告)日：2023-12-28

申请号：US18367072

申请日：2023-09-12

申请人： Apple Inc.

发明人： Daniel R. Bloom , Chelsea E. Wojeski , Edward Siahaan , Nathan Morris , Ryan S. Haley , Tian Shi Li , Toni Ristoski

IPC分类号： H04B1/3827

CPC分类号： H04B1/3827

摘要： An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.