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公开(公告)号:US11184696B1
公开(公告)日:2021-11-23
申请号:US17023240
申请日:2020-09-16
申请人: Apple Inc.
发明人: Tian Shi Li , Daniel R. Bloom , Jerzy S. Guterman , Jue Wang , Toni Ristoski , Jared M. Kole , Edward Siahaan , Eugene Antony Whang
摘要: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.
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公开(公告)号:US20230269513A1
公开(公告)日:2023-08-24
申请号:US17895028
申请日:2022-08-24
申请人: APPLE INC.
发明人: Benjamin A. Cousins , Jarrett Lagler , Dirk Schmelzer , Sebastien D. de Rivaz , Tian Shi Li , Phillip Qian , Rebecca Russell , Jeyakkrishnan Chengleput Srinivasan , Jue Wang , Jerzy S. Guterman , Joel C. Yamasaki
CPC分类号: H04R1/1025 , H02J7/0044 , H04R1/023 , H04R1/1016 , H04R1/1041 , H04R1/1075 , H04R2420/07 , H04R2460/11
摘要: A charging case for a pair of wireless earphones comprising: a housing having a peripheral wall that defines a shell; a frame insert coupled to the housing and extending into the shell, the frame insert having one or more insert walls that define first and second pockets sized and shaped to accept first and second wireless earphones, respectively, wherein the one or more insert walls cooperate with the housing primary wall to define a sealed chamber within the charging case; a lid coupled to the housing and operable between a closed position in which the lid covers the first and second pockets and an open position in which the first and second pockets are exposed; a speaker module disposed within the sealed chamber, the speaker module comprising an audio driver having a diaphragm that separates a front volume of the audio driver from a back volume of the audio driver and a speaker vent disposed within the back volume; one or more first openings formed through the peripheral wall and opening into the front volume, wherein the audio driver is positioned and aligned to emit sound into the front volume and through the one or more acoustic openings; and one or more second openings formed through the peripheral wall at a location spaced apart from the front volume, wherein at least one of the one or more second openings is an acoustic vent acoustically coupled to the back volume of the audio driver through the speaker vent ear tip.
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公开(公告)号:US11134327B2
公开(公告)日:2021-09-28
申请号:US16878536
申请日:2020-05-19
申请人: Apple Inc.
发明人: Jason J. LeBlanc , Daniel R. Bloom , Edward Siahaan , Phillip Qian , Lee M. Panecki , Eugene Antony Whang , Jared M. Kole , Audrey L. Sheng , Tian Shi Li
IPC分类号: H04R1/10 , H04R5/033 , H04R5/04 , G10K11/178
摘要: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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公开(公告)号:US11784673B2
公开(公告)日:2023-10-10
申请号:US17469001
申请日:2021-09-08
申请人: Apple Inc.
发明人: Daniel R. Bloom , Chelsea E. Wojeski , Edward Siahaan , Nathan Morris , Ryan S. Haley , Tian Shi Li , Toni Ristoski
IPC分类号: H04B1/3827
CPC分类号: H04B1/3827
摘要: An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.
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公开(公告)号:US20230262375A1
公开(公告)日:2023-08-17
申请号:US18138533
申请日:2023-04-24
申请人: Apple Inc.
发明人: Jason Joseph LeBlanc , Rohan Gupta , Robert D. Zupke , Todd K. Moyer , Cuneyt Bakan , Brooke L. Bunney , Justin T. Ng , Jeff A. Kalt , Tian Shi Li , Lionel B. Barrow
IPC分类号: H04R1/10
CPC分类号: H04R1/1041 , H04R1/1091 , H04R1/1066
摘要: A detachable headband for a headphone system can incorporate a headband identification circuit that stores or encodes a headband identification parameter value. When the headband becomes attached to an ear cup, the headband can transmit the headband identification parameter value to the ear cup.
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公开(公告)号:US20200280786A1
公开(公告)日:2020-09-03
申请号:US16878556
申请日:2020-05-19
申请人: Apple Inc.
发明人: Jared M. Kole , Daniel R. Bloom , Audrey L. Sheng , Tian Shi Li , Eugene Antony Whang , Edward Siahaan , Phillip Qian , Alex C. Hellwig , Oliver M. Hewitt , Yuta Kuboyama , Christopher S. Erickson , Sneha Kadetotad , Edwin J. Corona Aparicio , Rajesh Anantharaman , Jacob E. Mattingley , Tsu-Hui Lin , Robert D. Zupke , Dustin A. Hatfield , Axit H. Patel
摘要: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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公开(公告)号:US20230421196A1
公开(公告)日:2023-12-28
申请号:US18367072
申请日:2023-09-12
申请人: Apple Inc.
发明人: Daniel R. Bloom , Chelsea E. Wojeski , Edward Siahaan , Nathan Morris , Ryan S. Haley , Tian Shi Li , Toni Ristoski
IPC分类号: H04B1/3827
CPC分类号: H04B1/3827
摘要: An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.
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公开(公告)号:US11450999B2
公开(公告)日:2022-09-20
申请号:US17023013
申请日:2020-09-16
申请人: Apple Inc.
发明人: Eric T. SooHoo , Mahmoud R. Amini , Daniel R. Bloom , Sean T. McIntosh , Tian Shi Li , Jared M. Kole , Jason Joseph LeBlanc , Colin M. Ely , Peter J. Cameron , Michael A. Kinney , Eric S. Jol , Edward Siahaan , Robert D. Zupke , Rohan Gupta , Jordan J. Francis
IPC分类号: H01R39/12 , H01R12/61 , H01R12/77 , H01R13/422
摘要: Connector inserts and connector receptacles that have a small form factor and where when a connector insert and connector receptacle are mated, the connector insert can rotate and articulate relative to an electronic device housing the connector receptacle. The connector receptacle can be connected to components in the electronic device through a flexible circuit board having an amount of slack or excess length to allow the connector receptacle and the connector insert to rotate relative to the connected components. A bearing supporting the connector receptacle can articulate about an axis to allow the connector receptacle and connector insert to articulate relative to the connected components. The bearing can further support a locking mechanism to lock the connector insert in place in the connector receptacle.
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公开(公告)号:US20220085560A1
公开(公告)日:2022-03-17
申请号:US17023013
申请日:2020-09-16
申请人: Apple Inc.
发明人: Eric T. SooHoo , Mahmoud R. Amini , Daniel R. Bloom , Sean T. McIntosh , Tian Shi Li , Jared M. Kole , Jason Joseph LeBlanc , Colin M. Ely , Peter J. Cameron , Michael A. Kinney , Eric S. Jol , Edward Siahaan , Robert D. Zupke , Rohan Gupta , Jordan J. Francis
IPC分类号: H01R39/12 , H01R12/77 , H01R12/61 , H01R13/422
摘要: Connector inserts and connector receptacles that have a small form factor and where when a connector insert and connector receptacle are mated, the connector insert can rotate and articulate relative to an electronic device housing the connector receptacle. The connector receptacle can be connected to components in the electronic device through a flexible circuit board having an amount of slack or excess length to allow the connector receptacle and the connector insert to rotate relative to the connected components. A bearing supporting the connector receptacle can articulate about an axis to allow the connector receptacle and connector insert to articulate relative to the connected components. The bearing can further support a locking mechanism to lock the connector insert in place in the connector receptacle.
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公开(公告)号:US20200280785A1
公开(公告)日:2020-09-03
申请号:US16878547
申请日:2020-05-19
申请人: Apple Inc.
IPC分类号: H04R1/10
摘要: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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