Invention Application
- Patent Title: INTEGRATED PHOTONIC DEVICE WITH IMPROVED OPTICAL COUPLING
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Application No.: US17540626Application Date: 2021-12-02
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Publication No.: US20220091330A1Publication Date: 2022-03-24
- Inventor: Frederic BOEUF , Charles BAUDOT
- Applicant: STMicroelectronics (Crolles 2) SAS
- Applicant Address: FR Crolles
- Assignee: STMicroelectronics (Crolles 2) SAS
- Current Assignee: STMicroelectronics (Crolles 2) SAS
- Current Assignee Address: FR Crolles
- Priority: FR1654523 20160520
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/30 ; G02B6/124 ; G02B6/122 ; G02B6/126 ; G02B6/27

Abstract:
A three-dimensional photonic integrated structure includes a first semiconductor substrate and a second semiconductor substrate. The first substrate incorporates a first waveguide and the second semiconductor substrate incorporates a second waveguide. An intermediate region located between the two substrates is formed by a one dielectric layer. The second substrate further includes an optical coupler configured for receiving a light signal. The first substrate and dielectric layer form a reflective element located below and opposite the grating coupler in order to reflect at least one part of the light signal.
Public/Granted literature
- US11709315B2 Integrated photonic device with improved optical coupling Public/Granted day:2023-07-25
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