Invention Application
- Patent Title: PACKAGE EMBEDDED MAGNETIC POWER TRANSFORMERS FOR SMPS
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Application No.: US17025537Application Date: 2020-09-18
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Publication No.: US20220093314A1Publication Date: 2022-03-24
- Inventor: Anuj MODI , Huong DO , William J. LAMBERT , Krishna BHARATH , Harish KRISHNAMURTHY
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01F27/24
- IPC: H01F27/24 ; H01F30/06

Abstract:
Embodiments disclosed herein include power transformers for microelectronic devices. In an embodiment, a power transformer comprises a magnetic core that is a closed loop with an inner dimension and an outer dimension, and a primary winding around the magnetic core. In an embodiment, the primary winding has a first number of first turns connected in series around the magnetic core. In an embodiment, a secondary winding is around the magnetic core, and the secondary winding has a second number of second turns around the magnetic core. In an embodiment, individual ones of the second turns comprise a plurality of secondary segments connected in parallel.
Public/Granted literature
- US12154710B2 Package embedded magnetic power transformers for SMPS Public/Granted day:2024-11-26
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