公开(公告)号：US20220093314A1

公开(公告)日：2022-03-24

申请号：US17025537

申请日：2020-09-18

申请人： Intel Corporation

发明人： Anuj MODI ,  Huong DO ,  William J. LAMBERT ,  Krishna BHARATH ,  Harish KRISHNAMURTHY

IPC分类号： H01F27/24 ,  H01F30/06

摘要： Embodiments disclosed herein include power transformers for microelectronic devices. In an embodiment, a power transformer comprises a magnetic core that is a closed loop with an inner dimension and an outer dimension, and a primary winding around the magnetic core. In an embodiment, the primary winding has a first number of first turns connected in series around the magnetic core. In an embodiment, a secondary winding is around the magnetic core, and the secondary winding has a second number of second turns around the magnetic core. In an embodiment, individual ones of the second turns comprise a plurality of secondary segments connected in parallel.

公开(公告)号：US20220085143A1

公开(公告)日：2022-03-17

申请号：US17023249

申请日：2020-09-16

申请人： Intel Corporation

发明人： Beomseok CHOI ,  Huong DO ,  Sai VADLAMANI

IPC分类号： H01L49/02 ,  H01F27/28 ,  H01F27/32 ,  H01F27/245 ,  H01L23/31

摘要： Embodiments disclosed herein include magnetic structures and methods of forming such structures. In an embodiment, the magnetic structure includes an interconnect. In an embodiment, the interconnect comprises a core, where the core has a thickness and a length between a first end and a second end. In an embodiment, the core is conductive. In an embodiment, the interconnect further comprises a magnetic sheet surrounding the core. In an embodiment, the magnetic sheet comprises is a magnetic layer with a microstructure that comprises grains that are substantially aligned in a single direction.