Invention Application
- Patent Title: MUTILAYER ELECTRONIC COMPONENT
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Application No.: US17338124Application Date: 2021-06-03
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Publication No.: US20220093329A1Publication Date: 2022-03-24
- Inventor: Kyeong Jun KIM , Ho In JUN , Seul Gi KIM , Jin Sung CHUN , Jun Ho YUN
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2020-0120559 20200918
- Main IPC: H01G4/005
- IPC: H01G4/005 ; H01G4/30 ; H01G4/248

Abstract:
A multilayer electronic component includes: a body including first and second dielectric layers alternately disposed in a first direction; and external electrodes disposed on opposing end surfaces, respectively. A first internal electrode exposed to a first end surface and a first dummy pattern spaced apart from the first internal electrode and exposed to a second end surface are disposed on the first dielectric layer. A second internal electrode exposed to the second end surface and a second dummy pattern spaced apart from the second internal electrode and exposed to the first end surface are disposed on the second dielectric layer. The first and second internal electrodes include first and second main portions, respectively, and the first main portion and the second main portion are arranged in a staggered manner in a width direction.
Public/Granted literature
- US11657966B2 Multilayer electronic component Public/Granted day:2023-05-23
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