公开(公告)号：US20220076888A1

公开(公告)日：2022-03-10

申请号：US17176597

申请日：2021-02-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seul Gi KIM ,  Jin Sung CHUN ,  Chang Yong CHOI

IPC: H01G4/224 ,  H01G4/012 ,  H01G4/30 ,  H01G4/08

Abstract: A multilayer electronic component includes a body comprising a capacitance-forming portion including a dielectric layer and a plurality of internal electrodes layered with the dielectric layer interposed therebetween, and upper and lower cover portions disposed on upper and lower surfaces of the capacitance-forming portion, respectively; and external electrodes disposed on the body and electrically connected to at least some of the plurality of internal electrodes, respectively, wherein at least one of the upper cover portion and or the lower cover portion has a step structure, and the step structure has a shorter length and width as compared to the capacitance-forming portion.

公开(公告)号：US20200161048A1

公开(公告)日：2020-05-21

申请号：US16275785

申请日：2019-02-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Sung CHUN ,  Seul Gi KIM ,  Hyo Kyong SEO ,  Hae Suk CHUNG ,  Byung Sung KANG

IPC: H01G4/12 ,  H01G4/30 ,  H01G4/012 ,  H01G4/248 ,  H01G4/008

Abstract: A dielectric composition includes a ceramic powder, a high polymerization binder, and a low polymerization binder type dispersant having a degree of polymerization between 100 and 1,000.

公开(公告)号：US20220093329A1

公开(公告)日：2022-03-24

申请号：US17338124

申请日：2021-06-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kyeong Jun KIM ,  Ho In JUN ,  Seul Gi KIM ,  Jin Sung CHUN ,  Jun Ho YUN

IPC: H01G4/005 ,  H01G4/30 ,  H01G4/248

Abstract: A multilayer electronic component includes: a body including first and second dielectric layers alternately disposed in a first direction; and external electrodes disposed on opposing end surfaces, respectively. A first internal electrode exposed to a first end surface and a first dummy pattern spaced apart from the first internal electrode and exposed to a second end surface are disposed on the first dielectric layer. A second internal electrode exposed to the second end surface and a second dummy pattern spaced apart from the second internal electrode and exposed to the first end surface are disposed on the second dielectric layer. The first and second internal electrodes include first and second main portions, respectively, and the first main portion and the second main portion are arranged in a staggered manner in a width direction.

公开(公告)号：US20210134528A1

公开(公告)日：2021-05-06

申请号：US17149538

申请日：2021-01-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Sung CHUN ,  Seul Gi KIM ,  Hyo Kyong SEO ,  Hae Suk CHUNG ,  Byung Sung KANG

IPC: H01G4/12

Abstract: A dielectric composition includes a ceramic powder, a high polymerization binder, and a low polymerization binder type dispersant having a degree of polymerization between 100 and 1,000.

公开(公告)号：US20150082897A1

公开(公告)日：2015-03-26

申请号：US14492898

申请日：2014-09-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seul Gi KIM ,  Tae Hoon Kim ,  Yong Ho Won ,  Ho Joon Park ,  Sung Kwon Wi

IPC: G06F3/0354 ,  G06F3/044 ,  G06F3/045 ,  G01L1/22 ,  G01L1/14

CPC classification number: G06F3/044 ,  G02F1/13452 ,  G06F2203/04103 ,  G06F2203/04111 ,  H05K1/189 ,  H05K3/323 ,  H05K2201/10128

Abstract: Disclosed herein is a touch sensor module, including: a flexible cable provided with a terminal part; an adhesive layer formed to transfer an electrical signal by being contacted on one surface of the terminal part; a base substrate including an electrode pad which is formed to correspond to the terminal part and formed to be contact on the other surface of the adhesive layer; and a first passivation layer coating one end of the electrode pad.

Abstract translation: 这里公开了一种触摸传感器模块，包括：具有终端部件的柔性电缆; 形成为通过在端子部的一个表面上接触而传递电信号的粘合剂层; 基底基板，包括电极焊盘，所述电极焊盘形成为与所述端子部对应并且形成为在所述粘合剂层的另一个表面上接触; 以及涂覆电极焊盘一端的第一钝化层。