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    MULTILAYER CAPACITOR
    1.
    发明申请
    MULTILAYER CAPACITOR 审中-公开

    公开(公告)号：US20200027660A1

    公开(公告)日：2020-01-23

    申请号：US16171972

    申请日：2018-10-26

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jin Sung CHUN ,  Hae Suk CHUNG ,  Kyeong Jun KIM ,  Byung Sung KANG

    IPC: H01G4/12 ,  H01G4/008 ,  H01G4/232 ,  H01G4/30 ,  H01G4/012

    Abstract: A multilayer capacitor includes a capacitor body, a first external electrode, and a second external electrode. The capacitor body includes a plurality of first and second internal electrodes alternately stacked with dielectric layer interposed therebetween. The first and second external electrodes are electrically connected to the first and second internal electrodes, respectively. A first Schottky layer is Schottky-junctioned to an interface between the dielectric layer and the first internal electrode in the capacitor body. A second Schottky layer is Schottky-junctioned to an interface between the dielectric later and the second internal electrode in the capacitor body. The work function values of the first and second Schottky layers is higher than the work function values of the first and second internal electrodes.

    MUTILAYER ELECTRONIC COMPONENT
    2.
    发明申请
    MUTILAYER ELECTRONIC COMPONENT 有权

    公开(公告)号：US20220093329A1

    公开(公告)日：2022-03-24

    申请号：US17338124

    申请日：2021-06-03

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Kyeong Jun KIM ,  Ho In JUN ,  Seul Gi KIM ,  Jin Sung CHUN ,  Jun Ho YUN

    IPC: H01G4/005 ,  H01G4/30 ,  H01G4/248

    Abstract: A multilayer electronic component includes: a body including first and second dielectric layers alternately disposed in a first direction; and external electrodes disposed on opposing end surfaces, respectively. A first internal electrode exposed to a first end surface and a first dummy pattern spaced apart from the first internal electrode and exposed to a second end surface are disposed on the first dielectric layer. A second internal electrode exposed to the second end surface and a second dummy pattern spaced apart from the second internal electrode and exposed to the first end surface are disposed on the second dielectric layer. The first and second internal electrodes include first and second main portions, respectively, and the first main portion and the second main portion are arranged in a staggered manner in a width direction.

    MULTILAYER ELECTRONIC COMPONENT
    4.
    发明申请
    MULTILAYER ELECTRONIC COMPONENT 有权

    公开(公告)号：US20220076888A1

    公开(公告)日：2022-03-10

    申请号：US17176597

    申请日：2021-02-16

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Seul Gi KIM ,  Jin Sung CHUN ,  Chang Yong CHOI

    IPC: H01G4/224 ,  H01G4/012 ,  H01G4/30 ,  H01G4/08

    Abstract: A multilayer electronic component includes a body comprising a capacitance-forming portion including a dielectric layer and a plurality of internal electrodes layered with the dielectric layer interposed therebetween, and upper and lower cover portions disposed on upper and lower surfaces of the capacitance-forming portion, respectively; and external electrodes disposed on the body and electrically connected to at least some of the plurality of internal electrodes, respectively, wherein at least one of the upper cover portion and or the lower cover portion has a step structure, and the step structure has a shorter length and width as compared to the capacitance-forming portion.

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