公开(公告)号：US20240387110A1

公开(公告)日：2024-11-21

申请号：US18601290

申请日：2024-03-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ho In JUN ,  Eon Ju NOH ,  Myung Duk SEO ,  Kyeong Jun KIM ,  Kyo Sik KIM ,  Da Jeong LEE

IPC: H01G4/232 ,  H01G4/30 ,  H05K1/18

Abstract: An electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body, connected to the internal electrode, and including a low-reflection layer. Brightness of a surface of the low-reflection layer is lower than brightness of a surface of the body.

公开(公告)号：US20220093329A1

公开(公告)日：2022-03-24

申请号：US17338124

申请日：2021-06-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kyeong Jun KIM ,  Ho In JUN ,  Seul Gi KIM ,  Jin Sung CHUN ,  Jun Ho YUN

IPC: H01G4/005 ,  H01G4/30 ,  H01G4/248

Abstract: A multilayer electronic component includes: a body including first and second dielectric layers alternately disposed in a first direction; and external electrodes disposed on opposing end surfaces, respectively. A first internal electrode exposed to a first end surface and a first dummy pattern spaced apart from the first internal electrode and exposed to a second end surface are disposed on the first dielectric layer. A second internal electrode exposed to the second end surface and a second dummy pattern spaced apart from the second internal electrode and exposed to the first end surface are disposed on the second dielectric layer. The first and second internal electrodes include first and second main portions, respectively, and the first main portion and the second main portion are arranged in a staggered manner in a width direction.

公开(公告)号：US20250166903A1

公开(公告)日：2025-05-22

申请号：US18919756

申请日：2024-10-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ho In JUN ,  Seong Min KWON

IPC: H01G4/012 ,  H01G4/232 ,  H01G4/30

Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes disposed alternately in a first direction with the dielectric layer therebetween; first and second external electrodes disposed on the body and connected to the first and second internal electrodes, respectively; a first via electrode penetrating the dielectric layer and connecting two first internal electrodes adjacent to each other in the first direction; and a second via electrode penetrating the dielectric layer and connecting two second internal electrodes adjacent to each other in the first direction, wherein the two first via electrodes adjacent to each other in the first direction are shifted from each other, and the two second via electrodes adjacent to each other in the first direction are shifted from each other.

公开(公告)号：US20240212940A1

公开(公告)日：2024-06-27

申请号：US18384796

申请日：2023-10-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ho In JUN ,  Byung Jun JEON ,  Yong Won SEO ,  Chae Min PARK ,  Hyung Duk YUN ,  A Ra CHO

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01G4/008 ,  H01G4/12

Abstract: A multilayer electronic component includes a body including a first external electrode including a first base plating layer disposed on a third surface of the body and connected to the first internal electrode and a first electrode layer disposed on the first base plating layer, and a second external electrode including a second base plating layer disposed on a fourth surface of the body and connected to the second internal electrode and a second electrode layer disposed on the second base plating layer, wherein the first and second electrode layers include conductive metal and glass, and a 30 μm×5 μm region selected from a cross-section of the first base plating layer in the first and second directions includes three or more Ni grains having a grain size of 4 μm or greater.