- 专利标题: FIELD-EFFECT TRANSISTORS (FET) CIRCUITS EMPLOYING TOPSIDE AND BACKSIDE CONTACTS FOR TOPSIDE AND BACKSIDE ROUTING OF FET POWER AND LOGIC SIGNALS, AND RELATED COMPLEMENTARY METAL OXIDE SEMICONDUCTOR (CMOS) CIRCUITS
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申请号: US17025211申请日: 2020-09-18
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公开(公告)号: US20220093594A1公开(公告)日: 2022-03-24
- 发明人: Stanley Seungchul SONG , Deepak SHARMA , Bharani CHAVA , Hyeokjin LIM , Peijie FENG , Seung Hyuk KANG , Jonghae KIM , Periannan CHIDAMBARAM , Kern RIM , Giridhar NALLAPATI , Venugopal BOYNAPALLI , Foua VANG
- 申请人: QUALCOMM Incorporated
- 申请人地址: US CA San Diego
- 专利权人: QUALCOMM Incorporated
- 当前专利权人: QUALCOMM Incorporated
- 当前专利权人地址: US CA San Diego
- 主分类号: H01L27/095
- IPC分类号: H01L27/095 ; H03K19/0185 ; H01L23/528 ; H01L29/78
摘要:
Field-effect transistor (FET) circuits employing topside and backside contacts for topside and backside routing of FET power and logic signals. A FET circuit is provided that includes a FET that includes a conduction channel, a source, a drain, and a gate. The FET circuit also includes a topside metal contact electrically coupled with at least one of the source, drain, and gate of the FET. The FET circuit also includes a backside metal contact electrically coupled with at least one of the source, drain, and gate of the FET. The FET circuit also includes topside and backside metal lines electrically coupled to the respective topside and backside metal contacts to provide power and signal routing to the FET. A complementary metal oxide semiconductor (CMOS) circuit is also provided that includes a PFET and NFET that each includes a topside and backside contact for power and signal routing.
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