Invention Application
- Patent Title: FIELD EFFECT TRANSISTOR AND METHOD
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Application No.: US17070717Application Date: 2020-10-14
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Publication No.: US20220115498A1Publication Date: 2022-04-14
- Inventor: Lung-Kun CHU , Mao-Lin HUANG , Chung-Wei HSU , Jia-Ni YU , Kuo-Cheng CHIANG , Kuan-Lun CHENG , Chih-Hao WANG
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L27/092 ; H01L29/66 ; H01L29/78 ; H01L21/8234

Abstract:
A device includes a substrate, and a first semiconductor channel over the substrate. The first semiconductor channel includes a first nanosheet of a first semiconductor material, a second nanosheet of a second semiconductor material in physical contact with a topside surface of the first nanosheet, and a third nanosheet of the second semiconductor material in physical contact with an underside surface of the first nanosheet. The first gate structure is over and laterally surrounding the first semiconductor channel, and in physical contact with the second nanosheet and the third nanosheet.
Public/Granted literature
- US11626485B2 Field effect transistor and method Public/Granted day:2023-04-11
Information query
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