- 专利标题： POWDER SPRAYING DEVICE FOR A SEMICONDUCTOR MOLDING PROCESS AND SPRAYING METHOD THEREOF
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申请号： US17216209申请日： 2021-03-29
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公开(公告)号： US20220122860A1公开(公告)日： 2022-04-21
- 发明人: Po-Hung WU , Zun-Huan HUANG
- 申请人： Powertech Technology Inc.
- 申请人地址： TW Hukou Township
- 专利权人： Powertech Technology Inc.
- 当前专利权人： Powertech Technology Inc.
- 当前专利权人地址： TW Hukou Township
- 优先权： TW109136566 20201021
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; B29C43/58 ; B29C43/34 ; H01L21/56
摘要：
A powder spraying device has a first powder spraying tube and a second powder spraying tube arranged parallelly. The first powder spraying tube has a first opening formed on a bottom thereof. A first gate is mounted moveably on the first opening to selectively cover the first opening. The second powder spraying tube has a second opening formed on a bottom thereof. A second gate is mounted moveably on the second opening to selectively cover the second opening. When the first powder spraying tube and the second powder spraying tube are filled with different plastic particles, the first opening and the second opening are opened and closed at different times to spray different plastic particles so that the specific molding method requirements are met.
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