Invention Application
- Patent Title: POLISHING SLURRY COMPOSITION
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Application No.: US17511582Application Date: 2021-10-27
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Publication No.: US20220127495A1Publication Date: 2022-04-28
- Inventor: Jin Sook HWANG , Hyun Goo KONG , Eun Jin LEE
- Applicant: KCTECH CO., LTD.
- Applicant Address: KR Gyeonggi-do
- Assignee: KCTECH CO., LTD.
- Current Assignee: KCTECH CO., LTD.
- Current Assignee Address: KR Gyeonggi-do
- Priority: KR10-2020-0141358 20201028
- Main IPC: C09G1/02
- IPC: C09G1/02 ; C09K3/14

Abstract:
A polishing slurry composition is provided. The polishing slurry composition includes abrasive particles, an oxidizer, an iron-containing catalyst, and a stabilizer, and a retention rate of the oxidizer according to Equation 1 is 70% or greater. Retention rate (%) of oxidizer=(concentration (%) of oxidizer after 7 days at room temperature×100)/(initial concentration (%) of oxidizer in polishing slurry composition) [Equation 1]
Information query